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Y.Y. Lin
Observed names:
Y Y Lin,
Y. Y. Lin,
Yu-Hsing Lin
Institutions:
MediaTek (China),
MediaTek (Taiwan)
Observed institutions:
National Chung Cheng University,
University of New Mexico,
MediaTek (China),
Cornell University,
MediaTek (Taiwan),
National Cheng Kung University
show all 6
OpenAlex ID:
A5110076982
Constraints on Microcontact Printing Imposed by Stamp Deformation
2002
·
C. Y. Hui
, A. Jagota
, et al.
·
Langmuir
·
426
Cavity growth from crack-like defects in soft materials
2004
·
Y.Y. Lin
, C.Y. Hui
·
International Journal of Fracture
·
83
The mechanics of contact and adhesion of periodically rough surfaces
2001
·
C. Y. Hui
, Y. Y. Lin
, et al.
·
Journal of Polymer Science Part B Polymer Physics
·
72
The Role of Viscoelastic Adhesive Contact in the Sintering of Polymeric Particles
2001
·
Y.Y. Lin
, C.Y. Hui
, et al.
·
Journal of Colloid and Interface Science
·
55
Modeling the failure of an adhesive layer in a peel test
2002
·
Y. Y. Lin
, C. Y. Hui
, et al.
·
Journal of Polymer Science Part B Polymer Physics
·
27
Rheological properties and adhesive failure of thin viscoelastic layers
2002
·
A. J. Crosby
, K. R. Shull
, et al.
·
Journal of Rheology
·
25
PDF
Small scale geometric and material features at geometric discontinuities and their role in fracture analysis
2001
·
Martin L. Dunn
, C.Y. Hui
, et al.
·
International Journal of Fracture
·
22
Singularities of an inclined crack terminating at an anisotropic bimaterial interface
1997
·
Y.Y. Lin
, J.C. Sung
·
International Journal of Solids and Structures
·
22
Bonding of a viscoelastic periodic rough surface to a rigid layer
2002
·
C. Y. Hui
, Y. Y. Lin
, et al.
·
Journal of Polymer Science Part B Polymer Physics
·
12
Characterizations of the Perpendicular Magnetic Anisotropy in Ultrathin Films of Ta-CoFeB-MgO by X-Ray Photoelectron Spectroscopy
2013
·
Chih Wei Cheng
, H.M. Chen
, et al.
·
Advanced materials research
·
4
Machine compliance and hardening effects on cavity growth in soft adhesives
2005
·
Vijayanand Muralidharan
, C.Y. Hui
, et al.
·
International Journal of Adhesion and Adhesives
·
4
Viscoelastic contact, work of adhesion and the JKR technique
1999
·
Y Y Lin
, C Y Hui
, et al.
·
Journal of Physics D Applied Physics
·
4
PDF
Investigation of Polyimide Cracking Effects in Wafer-Level Chip Scale Package on Substrate (WLCSPoS) During Component-Level and Board-Level Reliability Testing
2025
·
Fa-Chuan Chen
, Bo-Kuan Yeh
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
·
2
Establishment of a postoperative bowel adhesion model in Rats
2024
·
Yu-Hsing Lin
, Pi-Hsin Chen
, et al.
·
International Journal of Scholarly Research in Science and Technology
·
2
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Works count:
14
Citation count:
760
H-index:
9
I10-index:
9
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