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Author

Soon‐Eng Ong

Observed name: Soon-Eng Ong
OpenAlex ID: A5110113113
Hard yet Tough Nanocomposite Coatings – Present Status and Future Trends
2007 · Sam Zhang, Hui Li Wang, et al. · Plasma Processes and Polymers · 133
Fundamental principles and applications of microfluidic systems
2007 · Soon-Eng Ong · Frontiers in bioscience · 90
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Relationship between bonding structure and mechanical properties of amorphous carbon containing silicon
2007 · Soon-Eng Ong, Sam Zhang, et al. · Diamond and Related Materials · 66
Influence of silicon concentration on the haemocompatibility of amorphous carbon
2007 · Soon-Eng Ong, Sam Zhang, et al. · Biomaterials · 52
A Low-Power Highly Sensitive Capacitive Accelerometer IC Using Auto-Zero Time-Multiplexed Differential Technique
2015 · Yan Mei Wang, Pak Kwong Chan, et al. · IEEE Sensors Journal · 47
Bonding structure and haemocompatibility of silicon-incorporated amorphous carbon
2006 · Sam Zhang, Hejun Du, et al. · Thin Solid Films · 36
Surface and electron emission properties of hydrogen-free diamond-like carbon films investigated by atomic force microscopy
2006 · Dongping Liu, Sam Zhang, et al. · Materials Science and Engineering A · 18
Temperature effect on bonding structures of amorphous carbon containing more than 30at.% silicon
2007 · Soon-Eng Ong, Sam Zhang, et al. · Diamond and Related Materials · 14
In-vitro cellular behavior on amorphous carbon containing silicon
2007 · Soon-Eng Ong, Sam Zhang, et al. · Thin Solid Films · 12
Simultaneous Incorporation of Magnesium and Fluorine Ions in Hydroxyapatite Coatings on Metallic Implant for Osseointegration and Stability
2013 · Yanli Cai, Sam Zhang, et al. · CRC Press eBooks · 4
Carbon Nanofiber or Carbon Nanotube?—The Role of Hydrogen During Rapid Thermal Processing
2011 · Huili Wang, Sam Zhang, et al. · Nanoscience and Nanotechnology Letters · 4
- Amorphous Carbon Coatings for Biological Applications
2016 · Soon-Eng Ong, Sam Zhang · CRC Press eBooks · 1
Advanced thermal ground plane for microelectronics
2011 · Jiacai Oh, Kingho Li, et al. · International Workshop on Thermal Investigations of ICs and Systems
Works count: 13
Citation count: 477
H-index: 9
I10-index: 9
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