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Larry D. Smith

A new wafer-level isothermal Joule-heated electromigration test for rapid testing of integrated-circuit interconnect
1987 · Robert E. Jones, Larry D. Smith · Journal of Applied Physics · 50
Yield considerations in the choice of 3D technology
2007 · Greg Smith, Larry Smith, et al. · IEEE International Symposium on Semiconductor Manufacturing conference proceedings · 46
Purification and properties of rat liver AMP deaminase
1969 · Larry D. Smith, Donald E. Kizer · Biochimica et Biophysica Acta (BBA) - Enzymology · 41
System power distribution network theory and performance with various noise current stimuli including impacts on chip level timing
2009 · Larry Smith, Shishuang Sun, et al. · Custom Integrated Circuits Conference · 32
Metrology needs for through-silicon via fabrication
2014 · Victor H. Vartanian, Richard A. Allen, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 31
Backside TSV protrusion induced by thermal shock and thermal cycling
2013 · Dingyou Zhang, Klaus Hummler, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 30
Adenylosuccinate lyase as an indicator of breast and prostate malignancies: A preliminary report
1987 · Vicki L. Reed, Donald O. Mack, et al. · Clinical Biochemistry · 28
Principles of Power Integrity for PDN Design:
2018 · Larry Smith, Eric Bogatin · IEEE International Symposium on Electromagnetic Compatibility · 26
A wide-range linear beat-by-beat cardiotachometer
1970 · W. Morton Caldwell, Larry D. Smith, et al. · Medical & Biological Engineering & Computing · 17
On the technology and ecosystem of 3D / TSV manufacturing
2011 · Klaus Hummler, Larry Smith, et al. · ASMC proceedings · 14
Effect of barrier process on electromigration reliability of Cu/porous low-k interconnects
2006 · Jung Woo Pyun, Won-Chong Baek, et al. · Journal of Applied Physics · 14
Effect of barrier thickness on electromigration reliability of Cu/porous low k interconnects
2005 · Jung Woo Pyun, Xia Lu, et al. · Applied Physics Letters · 12
Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits
2011 · Benjamin Backes, Colin McDonough, et al. · Journal of Electronic Testing · 11
Lane Departure Warning System Research and Test Development
2007 · Frank Barickman, Larry Smith, et al. · 10
FPGA Design for Signal and Power Integrity
2007 · Larry Smith, Hong Shi · 10
Effect of hepatocarcinogens on the adenine purine nucleotide cycle during the initiation phase of carcinogenesis.
1979 · L D Smith, R L Emerson, et al. · PubMed · 9
Modified procedures for the separation and fluorometric determination of adenine nucleotides
1977 · Richard B. Triplett, Larry D. Smith · Analytical Biochemistry · 9
Caspase-3 Colorimetric Assay
2002 · Lizhi Zeng, Larry D. Smith · BioTechniques · 8
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Electromigration behavior of 60 nm dual damascene Cu interconnects
2007 · Jung Woo Pyun, Won-Chong Baek, et al. · Journal of Applied Physics · 7
A comparison of succinyladenylate lyase activity and serum sialic acid as markers of malignancy
1985 · Donald O. Mack, Ellen M. Lewis, et al. · Biochemical Medicine · 7
Retinyl acetate inhibition of 3'-methyl-4-dimethyl-aminoazobenzene induced hepatic neoplasia
1990 · Donald O. Mack, Victoria L. Reed, et al. · International Journal of Biochemistry · 6
Kinetic and immunochemical evidence for induction of hepatic adenosine monophosphate deaminase by 3′-methyl-4-dimethylaminoazobenzene or thioacetamide
1970 · Donald E. Kizer, Larry D. Smith, et al. · Biochemical Pharmacology · 6
Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies
2008 · Sharath Hosali, Greg Smith, et al. · Integrated circuits and systems · 5
Measurement of Surfactant Loss in Porous Media
1975 · Larry Smith, E.W. Malmberg, et al. · SPE International Symposium on Oilfield Chemistry · 5
Kinetic, immunochemical, and physical studies on purified rat liver adenosine 5'-phosphate deaminase after induction with 3'-methyl-4-dimethylaminoazobenzene or thioacetamide.
1971 · L D Smith, D E Kizer · PubMed · 5
Works count: 46
Citation count: 466
H-index: 12
I10-index: 15
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