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Clément Sart

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
2018 · J. Jourdon, S. Lhostis, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 89
Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach
2018 · Thomas Wlanis, René Hammer, et al. · Microelectronics Reliability · 36
Cu/SiO2 hybrid bonding: Finite element modeling and experimental characterization
2016 · C. Sart, R. Estevez, et al. · Electronic System-Integration Technology Conference (ESTC) · 31
Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm
2024 · S. Lhostis, B. Ayoub, et al. · Journal of Electronic Materials · 9
Experimental and numerical investigations on Cu/low-k interconnect reliability during copper pillar shear test
2015 · Clement Sart, Sebastien Gallois-Garreignot, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 6
Numerical and experimental investigations on the hybrid bonding of Cu/SiÜ2 patterned surfaces using a cohesive model
2016 · Clement Sart, Rafael Estevez, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Influence of etching profile on pattern collapse in complementary metal oxide semiconductor image sensor pixel with deep trench isolation
2025 · Clément Sart, Jérôme Dubois, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 2
Numerical and Experimental Investigations on Mechanical Stress in 3D Stacked Integrated Circuits for Imaging Applications
2019 · Clément Sart · 2
Contribution of Raman Spectroscopy to Strain Metrology in Trench Array Structures : AM: Advanced Metrology
2025 · D. Monteil, D. Le Cunff, et al. · Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) · 1
Pattern Collapse Simulation in CMOS Image Sensors Devices
2023 · Philippe Garnier, Clement Sart, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 1
Contribution of Raman Spectroscopy to Strain Metrology in Trench Array Structures
2026 · Damien Monteil, Delphine Le Cunff, et al. · IEEE Transactions on Semiconductor Manufacturing
Un modèle d'ordre réduit pour la mécanique des interconnexions en microélectronique
2026 · Luong, Tuan-Khang, Sart, Clément, et al. · HAL (Le Centre pour la Communication Scientifique Directe)
Works count: 12
Citation count: 180
H-index: 5
I10-index: 3
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