Author

Huan-Yu Chiu

Institution: National Yang Ming Chiao Tung University

Observed institution: National Yang Ming Chiao Tung University

OpenAlex ID: A5111239370

3DIC with Stacked FinFET, Inter-Level Metal, and Field-Size ($\mathbf{25}\times \mathbf{33}\mathbf{mm}^{\mathbf{2}}$) Single-Crystalline Si on SiO 2 by Elevated-Epi

2024 · Bo-Jheng Shih, Yu-Ming Pan, et al. · IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 6

Elevated-Epi (Elepi) Technique for 3D IC With Stacked FinFETs, Interlevel Metal, and 25×33 mm2 Single-Crystalline Silicon on SiO2

2024 · Bo-Jheng Shih, Yu-Ming Pan, et al. · IEEE Transactions on Electron Devices · 4

Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration

2024 · Bo-Jheng Shih, Yu-Ming Pan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2

Location-Controlled Ge Grain Growth via Nanoscale Cooling-Hole-Assi-sted Laser Crystallization for Low-Thermal-Budget Monolithic 3D Integration

2026 · Yu-Ming Pan, Huan-Yu Chiu, et al. · ACS Applied Nano Materials

Continuous single-crystal germanium films using elevated-laser-liquid-phase-epitaxy technique for monolithic 3D integration

2025 · Yu-Ming Pan, Huan-Yu Chiu, et al. · Japanese Journal of Applied Physics

Large-Area Single-Crystal Ge Using Elevated Epitaxy Technique for Monolithic 3D Integration

2024 · Yu-Ming Pan, Huan-Yu Chiu, et al. · International Conference on Solid State Devices and Materials (SSDM)

Works count: 6

Citation count: 12

H-index: 2

I10-index: