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Qingyang Qiu

ORCID: 0009-0004-0883-711X
Observed ORCID: 0009-0004-0883-711X
OpenAlex ID: A5111291031
Recent achievements and performance of nanomaterials in microwave absorption and electromagnetic shielding
2024 · Shuai Zhang, Shuye Zhang, et al. · Advances in Colloid and Interface Science · 91
A review on heating mechanism, materials and heating parameters of microwave hybrid heated joining technique
2024 · Shuai Zhang, Qingyang Qiu, et al. · Journal of Manufacturing Processes · 51
Incomplete dissolved behavior and mechanical analysis of SnAgCu-SnBi composite solder structures for high-reliable package-on-package techniques
2024 · Shuai Zhang, Xinyi Jing, et al. · Materials Characterization · 16
Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation
2024 · Shuai Zhang, Xuesong Quan, et al. · Materials Letters · 13
Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances
2024 · Shuai Zhang, Qingyang Qiu, et al. · Materials Today Communications · 11
Emerging trends and obstacles in Damascus processing and electroplating for Chiplet industries: A review
2024 · Yuntao Sun, Qingyang Qiu, et al. · Materials Science in Semiconductor Processing · 7
A review of heating mechanisms, process parameters, and defect-minimized densification applications of microwave sintering in metals
2026 · Qingyang Qiu, Yuntao Sun, et al. · Advanced Materials Joining · 1
Ti‐Ni‐Nb合金でろう付けしたTi‐22A‐l25Nb合金継手の微細構造進展と機械的性質
2016 · Y Wang, Xiaohu Cai, et al. · Materials Chemistry and Physics · 1
A Novel Homogenization Strategy for the Equivalent Modelling of Glass Substrates
2025 · Shuye Zhang, Guoli Sun, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Highly Efficient and Wearable Thermoelectric Composites Based on Polyaniline/Filled-Skutterudite Composites
2023 · Shuai Zhang, Qingyang Qiu, et al. · SSRN Electronic Journal
Works count: 10
Citation count: 191
H-index: 6
I10-index: 5
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