Author

Andreas Wien

Observed names: A. WIEN, A. Wien, Wien, A., Wien, Andreas
OpenAlex ID: A5111424935
2002 · W. Simon, R. Kulke, et al. · IEEE MTT-S International Microwave Symposium digest · 25
1999 · W. Simon, R. Kulke, et al. · The International journal of microcircuits and electronic packaging · 17
2002 · W. Simon, B. Schauwecker, et al. · European Microwave Conference (EuMC) · 13
1995 · C. T. Iatrou, D. R. Whaley, et al. · International Journal of Infrared and Millimeter Waves · 12
2016 · M.A. Saporetti, L.J. Foged, et al. · European Conference on Antennas and Propagation · 8
2015 · Manuel Sierra Castañer, L. J. Foged, et al. · 6
2011 · W. Simon, Andreas Lauer, et al. · European Conference on Antennas and Propagation · 6
2010 · A. Wien, A. Lauer, et al. · IEEE MTT-S International Microwave Symposium digest · 6
2013 · Manfred Thumm, Walter Kasparek, et al. · IEEE Transactions on Antennas and Propagation · 5
2003 · W. Simon, A. Lauer, et al. · IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) · 5
1995 · M. Kuntze, E. Borie, et al. · Elsevier eBooks · 5
2012 · Winfried Simon, Andreas Lauer, et al. · Digest - IEEE Antennas and Propagation Society. International Symposium · 3
2004 · W. Simon, B. Schauwecker, et al. · International Journal of RF and Microwave Computer-Aided Engineering · 3
1995 · E. Giguet, A. N. Dubrovin, et al. · Infoscience (Ecole Polytechnique Fédérale de Lausanne) · 3
1994 · C. DEL RĺO, J. M. NET, et al. · International Journal of Electronics · 3
1998 · W. Simon, L. Baggen, et al. · European Microwave Conference (EuMC) · 2
2012 · Winfried Simon, Andreas Lauer, et al. · International Conference on Electromagnetics in Advanced Applications (ICEAA) · 1
2003 · Dietmar Kother, Andreas Lauer, et al. · European Microwave Conference (EuMC) · 1
1995 · M. Pain, G. Tonon, et al. · Elsevier eBooks · 1
2024 · Andreas Lauer, Thorsten Liebig, et al. · IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization
2024 · Enrico Tolin, Achim Bahr, et al. · IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Works count: 36
Citation count: 144
H-index: 6
I10-index: 4
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