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Alexander B. Lostetter
Observed names:
A. B. Lostetter,
A. Lostetter,
A.B. Lostetter,
Alex Lostetter,
Alexander Lostetter
Institution:
Arkansas Power Electronics International
Observed institutions:
Wolfspeed, Inc. (United States),
Arkansas Power Electronics International,
University of Arkansas at Fayetteville,
Virginia Tech
OpenAlex ID:
A5111583327
A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices
2013
·
Bret Whitaker
, Adam Barkley
, et al.
·
IEEE Transactions on Power Electronics
·
449
Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments
2004
·
J. Homberger
, A.B. Lostetter
, et al.
·
IEEE Aerospace Conference (AERO)
·
175
An overview to integrated power module design for high power electronics packaging
2000
·
A.B. Lostetter
, F. Barlow
, et al.
·
Microelectronics Reliability
·
94
High-Temperature Silicon-on-Insulator Gate Driver for SiC-FET Power Modules
2012
·
Javier Valle-Mayorga
, Caleb P. Gutshall
, et al.
·
IEEE Transactions on Power Electronics
·
58
High-temperature silicon carbide and silicon on insulator based integrated power modules
2009
·
A. Lostetter
, J. Hornberger
, et al.
·
IEEE Vehicle Power and Propulsion Conference (VPPC)
·
48
A 4H Silicon Carbide Gate Buffer for Integrated Power Systems
2013
·
Nance Ericson
, Shane Frank
, et al.
·
IEEE Transactions on Power Electronics
·
43
A high-temperature multichip power module (MCPM) inverter utilizing silicon carbide (SiC) and silicon on insulator (SOI) electronics
2006
·
Jared M. Homberger
, Edgar Cilio
, et al.
·
IEEE Power Electronics Specialists Conference (PESC)
·
43
Evaluation of gold and aluminum wire bond performance for high temperature (500 °C) silicon carbide (SiC) power modules
2005
·
H.A. Mustain
, A.B. Lostetter
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
39
A Fully Integrated 300°C, 4 kW, 3-Phase, SiC Motor Drive Module
2007
·
Jared M. Hornberger
, Edgar Cilio
, et al.
·
IEEE Power Electronics Specialists Conference (PESC)
·
38
Design of a 250 kW, 1200 V SiC MOSFET-based three-phase inverter by considering a subsystem level design optimization approach
2017
·
Ajith H. Wijenayake
, Kraig J. Olejniczak
, et al.
·
IEEE Energy Conversion Congress and Exposition (ECCE)
·
36
A Novel High Density 100kW Three-Phase Silicon Carbide (SIC) Multichip Power Module (MCPM) Inverter
2007
·
Edgar Cilio
, Jared Homberger
, et al.
·
Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition
·
33
Low cost flex substrates for miniaturized electronic assemblies
2002
·
F. Barlow
, A. Lostetter
, et al.
·
Microelectronics Reliability
·
32
Ultra-Lightweight, High Efficiency SiC Based Power Electronic Converters for Extreme Environments
2006
·
S. Mounce
, B. McPherson
, et al.
·
IEEE Aerospace Conference (AERO)
·
31
High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications
2014
·
Bret Whitaker
, Zach Cole
, et al.
·
IEEE Workshop on Wide Bandgap Power Devices and Applications
·
29
High-temperature integration of silicon carbide (SiC) and silicon-on-insulator (SOI) electronics in multichip power modules (MCPMs)
2005
·
J. Hornberger
, S. Mounce
, et al.
·
European Conference on Power Electronics and Applications
·
27
High-temperature silicon carbide (SiC) power switches in multichip power module (MCPM) applications
2005
·
J.M. Hornberger
, S.D. Mounce
, et al.
·
IEEE Industry Applications Society Annual Meeting (IAS)
·
23
A review of SiC power module packaging technologies: Attaches, interconnections, and advanced heat transfer
2017
·
Brandon S. Passmore
, Alexander B. Lostetter
·
IEEE International Workshop on Integrated Power Packaging (IWIPP)
·
20
A UVLO Circuit in SiC Compatible With Power MOSFET Integration
2014
·
Michael D. Glover
, Paul Shepherd
, et al.
·
IEEE Journal of Emerging and Selected Topics in Power Electronics
·
20
Ultra-Wide Temperature (-230°C to 130°C) DC-Motor Drive with SiGe Asynchronous Controller
2008
·
Jack Bourne
, Roberto Schupbach
, et al.
·
IEEE Aerospace Conference (AERO)
·
20
Polymer thick film (PTF) and flex technologies for low cost power electronics packaging
2002
·
A.B. Lostetter
, F. Barlow
, et al.
·
IEEE International Workshop on Integrated Power Packaging (IWIPP)
·
20
A high-frequency, high-efficiency silicon carbide based phase-shifted full-bridge converter as a core component for a high-density on-board vehicle battery charging system
2013
·
Bret Whitaker
, Adam Barkley
, et al.
·
IEEE ECCE Asia Downunder
·
19
High voltage, high power density bi-directional multi-level converters utilizing silicon and silicon carbide (SiC) switches
2008
·
Bradley Reese
, Marcelo Schupbach
, et al.
·
Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition
·
19
High-Performance, Wide-Bandgap Power Electronics
2014
·
Ty McNutt
, Brandon Passmore
, et al.
·
Journal of Electronic Materials
·
18
High Temperature (250 °c) Sic Power Module for Military Hybrid Electrical Vehicle Applications
2011
·
R. M. Schupbach
, B. McPherson
, et al.
·
SAE technical papers on CD-ROM/SAE technical paper series
·
17
High-frequency AC-DC conversion with a silicon carbide power module to achieve high-efficiency and greatly improved power density
2013
·
Bret Whitaker
, Adam Barkley
, et al.
·
IEEE International Symposium on Power Electronics for Distributed Generation Systems (PEDG)
·
16
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Works count:
78
Citation count:
1,579
H-index:
20
I10-index:
33
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