Author

Maaike M. Visser Taklo

Observed names: Dr. Maaike M. V. Taklo, M M V Taklo, M. M. V. Taklo, M. Taklo, M.M. Visser Taklo, M.M.V. Taklo, M.M.Visser Taklo, Maaike M V Taklo, Maaike M. V. Taklo, Maaike M. Visser. Taklo, Maaike M.V. Taklo, Maaike M.Visser Taklo, Maaike Margrete Visser Taklo, Maaike Taklo, Maaike Visser Taklo, Taklo Maaike M. Visser, Taklo, Maaike M. Visser, Taklo, Maaike M.V.

Institution: SINTEF

Observed institutions: SINTEF, Fraunhofer Research Institution for Microsystems and Solid State Technologies, SINTEF Digital

OpenAlex ID: A5111643313

Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold

2004 · M M V Taklo, P Storås, et al. · Journal of Micromechanics and Microengineering · 106

3D Integration technology: Status and application development

2010 · Peter Ramm, Armin Klumpp, et al. · European Solid-State Circuits Conference (ESSCIRC) · 84

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3D System-on-Chip technologies for More than Moore systems

2009 · Peter Ramm, Armin Klumpp, et al. · Microsystem Technologies · 63

AlAl thermocompression bonding for wafer-level MEMS sealing

2014 · N. Malik, K. Schjølberg-Henriksen, et al. · Sensors and Actuators A Physical · 61

Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring

2009 · Andreas Vogl, Dag T. Wang, et al. · Sensors and Actuators A Physical · 50

Nanoparticle assembly and sintering towards all-copper flip chip interconnects

2015 · Jonas Zurcher, Kerry Yu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 42

Au-Sn SLID Bonding: A Reliable HT Interconnect and Die Attach Technology

2013 · Torleif André Tollefsen, Andreas Larsson, et al. · Metallurgical and Materials Transactions B · 41

Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system

2011 · Laurens Kwakman, German Franz, et al. · AIP conference proceedings · 39

Wafer-level Au–Au bonding in the 350–450 °C temperature range

2014 · Hannah R Tofteberg, Kari Schjølberg-Henriksen, et al. · Journal of Micromechanics and Microengineering · 35

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Anodic bonding of glass to aluminium

2005 · K. Schjølberg-Henriksen, E. Poppe, et al. · Microsystem Technologies · 30

Impact of SiO 2 on Al–Al thermocompression wafer bonding

2015 · Nishant Malik, Kari Schjølberg-Henriksen, et al. · Journal of Micromechanics and Microengineering · 26

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All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering

2016 · Jonas Zurcher, Luca Del Carro, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24

Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

2010 · Jakob Gakkestad, Per Dalsjo, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 19

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Low-temperature plasma activated bonding for a variable optical attenuator

2007 · Kari Schjølberg-Henriksen, Sigurd Moe, et al. · Sensors and Actuators A Physical · 17

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

2016 · Simon Bleiker, Maaike Visser Taklo, et al. · Micromachines · 16

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Bending machine for testing reliability of flexible electronics

2017 · Daniel Nilsen Wright, Astrid-Sofie B. Vardoy, et al. · IMAPS Nordic Conference on Microelectronics Packaging (NordPac) · 13

Characterization of hermetic wafer-level Cu-Sn SLID bonding

2012 · H. J. van de Wiel, A-S. B. Vardoy, et al. · Electronic System-Integration Technology Conference (ESTC) · 12

Oxide charges induced by plasma activation for wafer bonding

2002 · K. Schjølberg-Henriksen, M.M. Visser Taklo, et al. · Sensors and Actuators A Physical · 10

3D MEMS and IC Integration

2008 · Maaike M. Visser. Taklo, Nicolas Lietaer, et al. · MRS Proceedings · 9

Reliable HT electronic packaging — Optimization of a Au-Sn SLID joint

2012 · Torleif A. Tollefsen, Maaike M. Visser Taklo, et al. · Electronic System-Integration Technology Conference (ESTC) · 8

SnAg Microbumps for MEMS-Based 3-D Stacks

2009 · R. Johannessen, M. Taklo, et al. · IEEE Transactions on Advanced Packaging · 8

TSV development for miniaturized MEMS acceleration switch

2010 · Nicolas Lietaer, Anand Summanwar, et al. · IEEE International D Systems Integration Conference · 7

The European 3D Technology Platform (e-CUBES)

2010 · Peter Ramm, Armin Klumpp, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 7

Technologies enabling 3D stacking of MEMS

2010 · Maaike M. Visser Taklo, Michal M. Mielnik, et al. · BIBSYS Brage (BIBSYS (Norway)) · 7

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Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)

2009 · Kari Schjølberg-Henriksen, Maaike Margrete Visser Taklo, et al. · Springer eBooks · 7

Works count: 80

Citation count: 847

H-index: 15

I10-index: 18