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Seung-Kyu Lim

Observed names: Seung-kyu Lim, SeungKyu Lim, Seungkyu Lim
OpenAlex ID: A5111848926
Thermal adsorption-enhanced atomic layer etching of Si3N4
2017 · Woo-Hee Kim, Dougyong Sung, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 26
Electroless Nickel Alloy Deposition on SiO2 for Application as a Diffusion Barrier and Seed Layer in 3D Copper Interconnect Technology
2014 · Tae-Yoo Kim, Hwa-Jin Son, et al. · Journal of Nanoscience and Nanotechnology · 13
The deposit stress behavior and magnetic properties of electrodeposited Ni-Co-Fe ternary alloy films
2012 · Jin-Soo Kim, Jun-Ho Kwak, et al. · Journal of the Korean Physical Society · 7
Fabrication of a two-step Ni stamp for blind via hole application on PWB
2009 · In-Soo Park, Jin-Soo Kim, et al. · Microelectronic Engineering · 7
Fabrication of a Touch Sensor for Flat Panel Displays Using Poly(3,4-ethylenedioxythiophene):Poly(styrene sulfonate) with Dimethylsulfoxide by Soft Lithography
2012 · Seung-Kyu Lim, Eun-Mi Park, et al. · Japanese Journal of Applied Physics · 6
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Electroless Ni alloy plating as a diffusion barrier for through silicon vias in three-dimensional packaging
2015 · Taeyoo Kim, Byungwook Ahn, et al. · Japanese Journal of Applied Physics · 4
Electrical and structural properties of a Co-sputtered SiO2-Pt composite thin film for an embedded resistor
2012 · Seung-Kyu Lim, Seong-Hun Na, et al. · Journal of the Korean Physical Society · 4
Electrical Resistivities and TCR Behavior of Co-Sputtered TaN-(Ag, Cu) Nanocomposites
2009 · In-Soo Park, Seong-Hun Na, et al. · Journal of the Korean Physical Society · 4
Experimental study of bump void formation according to process conditions
2013 · Seong-Hun Na, Seung-Kyu Lim, et al. · Microelectronics Reliability · 3
Fabrication of a Ni Nano-Imprint Stamp for an Anti-Reflective Layer Using an Anodic Aluminum Oxide Template
2013 · Eun-Mi Park, Seung-Kyu Lim, et al. · Journal of Nanoscience and Nanotechnology · 2
Silicon Interposer BGA Package with a Cu-Filled Through Silicon via and a Multilayer Redistribution Layer Fabricated via Electroplating
2014 · Taeyoo Kim, Hwajin Son, et al. · Journal of Nanoscience and Nanotechnology · 1
Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu
2012 · Seong-Hun Na, Jin-Soo Kim, et al. · Journal of the Korean Physical Society · 1
Fabrication and Characteristics of Through Silicon Vias Interconnection by Electroplating
2011 · Jae-Gwon Jang, Seung-Kyu Lim, et al. · Japanese Journal of Applied Physics · 1
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Electrical and Structural Properties of Ni-60%Cr Thin Film in an Embedded Resistor
2014 · Tae-Yoo Kim, Hwa-Jin Son, et al. · 대한금속재료학회지
Electoless NiP diffusion barrier deposited on through-Si vias
2013 · Tae‐Yoo Kim, Hwa-Jin Son, et al. · 한국표면공학회 학술발표회 초록집
The effect of an applied magnetic field on the (111) texture of a NiFe layer for perpendicular magnetic recording media
2012 · Jin-Soo Kim, Seong-Hun Na, et al. · Journal of the Korean Physical Society
Wafer Level Package Using Au-Sn Eutectic Bonding and Ni/Au-Sn Plated Metal Wall
2006 · Yoon-Sik Kim, Geun-Hee Jeong, et al. · ECS Meeting Abstracts
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Works count: 17
Citation count: 79
H-index: 5
I10-index: 2
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