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Cheng-Ta Ko

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
2017 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 170
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 94
Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers
2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 57
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
2018 · Cheng-Ta Ko, Henry Yang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 55
Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration
2020 · John H. Lau, Cheng-Ta Ko, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 49
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
2017 · John Lau, Ming Li, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 46
Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration
2013 · Chun-Hsien Chien, Ching-Kuan Lee, et al. · IMAPSource Proceedings · 44
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
2011 · Ching-Kuan Lee, Tao-Chih Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 40
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
2018 · Cheng-Ta Ko, Chieh-Lin Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
Embedded Active Device Packaging Technology for Next-Generation Chip-in-Substrate Package, CiSP
2006 · Cheng-Ta Ko, Shoulung Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
2012 · Ching-Kuan Lee, Tao-Chih Chang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 33
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
2018 · Cheng-Ta Ko, Henry Yang, et al. · Journal of Microelectronics and Electronic Packaging · 31
Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
2015 · Zhi-Cheng Hsiao, Cheng-Ta Ko, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 29
A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package
2017 · Puru Burce Lin, Cheng-Ta Ko, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 28
Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme
2012 · Yao-Jen Chang, Cheng-Ta Ko, et al. · IEEE Electron Device Letters · 28
Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
2020 · John H. Lau, Cheng-Ta Ko, et al. · Journal of Microelectronics and Electronic Packaging · 27
Performance and process characteristic of glass interposer with through-glass-via(TGV)
2013 · Chun-Hsien Chien, Hsun Yu, et al. · IEEE International D Systems Integration Conference · 27
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
2018 · John Lau, Ming Li, et al. · Journal of Microelectronics and Electronic Packaging · 26
An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications
2019 · Yu-Min Lin, Sheng-Tsai Wu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
2018 · John Lau, Zhang Li, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
High-Density Hybrid Substrate for Heterogeneous Integration
2022 · Tony Chia-Yu Peng, John H. Lau, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 23
A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
2012 · Cheng-Ta Ko, Zhi-Cheng Hsiao, et al. · IEEE Transactions on Device and Materials Reliability · 22
Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
2020 · Tzu-Chieh Chou, Kai-Ming Yang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 21
Fan-Out Panel-Level Packaging of Mini-LED RGB Display
2021 · John H. Lau, Cheng-Ta Ko, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 20
Wafer-level 3D integration using hybrid bonding
2010 · Cheng-Ta Ko, Kuan-Neng Chen, et al. · IEEE International D Systems Integration Conference · 20
Works count: 88
Citation count: 1,433
H-index: 22
I10-index: 43
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