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Charles L. Reynolds

Binary Neural Network as a Flexible Integrated Circuit for Odour Classification
2020 · Emre Ozer, Jedrzej Kufel, et al. · IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) · 22
Construction of Natural Appearing Female Genitalia in the Male Transsexual
1979 · David W. Foerster, Charles L. Reynolds · Plastic & Reconstructive Surgery · 21
To Ensemble or Not Ensemble: When Does End-to-End Training Fail?
2021 · Andrew Webb, Charles Reynolds, et al. · Lecture notes in computer science · 17
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Joint Training of Neural Network Ensembles
2019 · Webb, Andrew Michael, Reynolds, Charles, et al. · arXiv (Cornell University) · 15
Development of a Low CTE chip scale package
2013 · Tomoyuki Yamada, Masahiro Fukui, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 12
Multiple Mesotheliomas of the Hydrocele Sac: A Case Report
1958 · Charles L. Reynolds · The Journal of Urology · 11
Inspection / Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages
2019 · Feng Xue, Joe Zou, et al. · International Conference on Electronics Packaging (ICEP) · 5
Transcending Historical Exceptionalism through Sponsored Mentorship to Foundationally Minoritized Americans Aspiring to Become Physicians
2024 · Carmen Black, Charles Reynolds · The American Journal of Geriatric Psychiatry Open Science Education and Practice · 4
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Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer/Panel Level Packaging
2022 · Feng Xue, Zhihua Zou, et al. · International Conference on Electronics Packaging (ICEP) · 3
A study of ileal substitution for the creation of a continent urinary bladder
1960 · Charles L. Reynolds · The American Journal of Surgery · 3
AOI Pattern Detection Study for Fine Pitch Advanced Substrate
2023 · Feng Xue, Zhihua Zou, et al. · International Conference on Electronics Packaging (ICEP) · 2
Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness
2021 · Feng Xue, Charles Reynolds, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2
Inspection/metrology benchmarking on fine pitch design substrate for advanced packages
2017 · Feng Xue, Hiroyuki Watanabe, et al. · International Conference on Electronics Packaging (ICEP) · 2
Organic Chip Scale Package (CSP) Development for Flip Chip Applications
2013 · Tomoyuki Yamada, Masahiro Fukui, et al. · IMAPSource Proceedings · 2
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Subpubic Urethropexy: A New Remedy for Stress Incontinence
1974 · Charles L. Reynolds, Harry C. Miller · The Journal of Urology · 2
Practical Approach to the Male Chronic Neurogenic Bladder
1960 · Charles L. Reynolds, Ralph Smith · The Journal of Urology · 2
Finite Element Modeling of C4 Cracking in a Large Die Large Laminate Coreless Flip Chip Package
2016 · Shidong Li, Tuhin Sinha, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Benchmarking AOI Capabilities for Fine Pitch Substrate Inspection
2026 · Feng Xue, Charles Reynolds, et al. · International Conference on Electronics Packaging (ICEP)
Transformer Model Detects Antidepressant Use From a Single Night of Sleep, Unlocking an Adherence Biomarker
2025 · Mirzazadeh, Ali, Cadavid, Simon, et al. · arXiv (Cornell University)
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A high performance Multi Component Carrier with Chip Scale Package
2016 · Hongqing Zhang, Charles Reynolds, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
Equipment maintenance, operating costs and safety for Rochester Institute of Technology's Integrated Circuit Laboratory
2002 · L. Fuller, S. Blondell, et al. · Biennial University/Government/Industry Microelectronics Symposium
Works count: 21
Citation count: 126
H-index: 6
I10-index: 6
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