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Jingguang Yao
Institution:
Henan Polytechnic University
Observed institution:
Henan Polytechnic University
OpenAlex ID:
A5113413466
Copper Wire Bonding: A Review
2023
·
Hongliang Zhou
, Andong Chang
, et al.
·
Micromachines
·
45
PDF
A Review of Silver Wire Bonding Techniques
2023
·
Bin An
, Hongliang Zhou
, et al.
·
Micromachines
·
24
PDF
Simulation study on the effect of palladium layer thickness and temperature on the bonding properties of palladium coated copper wire
2024
·
Bin An
, Hongliang Zhou
, et al.
·
Microelectronics Reliability
·
7
Experimental study on spheroidal morphology of palladium coated copper wire with different palladium layer thickness
2024
·
Bin An
, Hongliang Zhou
, et al.
·
APL Materials
·
5
Simulation of intergranular crack extension at Cu/Al wire bonding interface
2025
·
Jingguang Yao
, Hongliang Zhou
, et al.
·
Microelectronics Reliability
·
1
A review of copper wire bonding reliability
2026
·
Ziming Wang
, Hongliang Zhou
, et al.
·
Microelectronics Reliability
Multiphysics modeling and parameter-fracture synergistic optimization for dynamic looping of palladium-coated copper wire
2026
·
Jingguang Yao
, Hongliang Zhou
, et al.
·
Journal of Science Advanced Materials and Devices
Study on Bonding Performance of Palladium-Coated Copper Wires with Different Palladium Layer Thicknesses
2026
·
Jingguang Yao
, Hongliang Zhou
, et al.
·
SSRN Electronic Journal
Study on Bonding Performance of Palladium-Coated Copper Wires with Different Palladium Layer Thicknesses
2026
·
Jingguang Yao
, Hongliang Zhou
, et al.
·
SSRN Electronic Journal
Study on Bonding Performance of Palladium-Coated Copper Wires with Different Palladium Layer Thicknesses
2025
·
Jingguang Yao
, Hongliang Zhou
, et al.
·
SSRN Electronic Journal
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Works count:
10
Citation count:
82
H-index:
4
I10-index:
2
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