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Author

Siquan Lyu

Institution: Xidian University
Observed institution: Xidian University
OpenAlex ID: A5113417618
Miniatured and High-density 3D Solenoid Inductor Based on TSV Arrays
2024 · Xiangkun Yin, Siquan Lyu, et al. · 2
Thermal Cycling Reliability Analysis of 2.5D Chiplet Based on Silicon Interposer
2024 · Xiang Li, Xiangkun Yin, et al. · 1
Compact Quad-band Filter with Bridged-T Coil Based on Through-Silicon Vias Technology
2023 · Siquan Lyu, Xiangkun Yin · International Conference on Electronics Technology (ICET)
Works count: 3
Citation count: 3
H-index: 1
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