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Kang Renke

Observed names: K RENKE, KANG Renke, Renke KANG, Renke Kang, 康仁科 Kang Renke
OpenAlex ID: A5113525948
A critical review on the chemical wear and wear suppression of diamond tools in diamond cutting of ferrous metals
2019 · Guo Jiang, Zhang Jianguo, et al. · International Journal of Extreme Manufacturing · 150
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Microstructure studies of the grinding damage in monocrystalline silicon wafers
2007 · Z YINXIA, K RENKE, et al. · Rare Metals · 20
Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method
2015 · Haijun Liu, Zhigang Dong, et al. · Metrology and Measurement Systems · 17
Study on Wear of Grinding Wheel in Ultrasonic Assisted Dry Side Grinding of SiCf/SiC Composites
2022 · DONG Zhigang, MA Huaiyao, et al. · Journal of Mechanical Engineering · 10
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Study on Removal Mechanism of Ultrasonic Elliptical Vibration Cutting of Tungsten Heavy Alloy
2023 · PAN Yanan, BAO Yan, et al. · Journal of Mechanical Engineering · 7
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State-of-the-art and Prospectives of Ultra-precision Grinding Technology for Semiconductor Substrates
2023 · GUO Dongming, KANG Renke · Journal of Mechanical Engineering · 7
Analysis on Mechanical Property of Anisotropy of KDP Crystal
2008 · Kang Renke · Rengong jingti xuebao · 7
Experimental Investigation on the Detection Technique for Surface Layer Damage of Machined Silicon Wafers
2011 · Kang Renke · Rengong jingti xuebao · 6
Ultra-precision Grinding Technology and Grinder of Silicon Wafers
2010 · Shu Xiang-Long, Kang Renke, et al. · Zhongguo jixie gongcheng · 6
Damage detection and analysis of machined KDP crystal subsurface
2007 · Kang Renke · Optics and Precision Engineering · 6
Experimental Study on Laser Cutting Based on Removal Forms for Aluminum Alloy Sheet
2012 · 王彦飞 Wang Yanfei, 王续跃 Wang Xuyue, et al. · Chinese Journal of Lasers · 5
Material removal rate in chemical-mechanical polishing of wafers based on particle trajectories
2010 · Su Jianxiu, Chen Xiqu, et al. · Journal of Semiconductors · 5
Effect of Polishing Parameter on Material Removal and Surface Quality of KDP Crystal
2010 · Wang Bi-ling, Hang Gao, et al. · Rengong jingti xuebao · 5
Study of Abrasive Wear in Monocrystal Silicon Grinding with Molecular Dynamic Simulation
2008 · Guo Xiaoguang, Dongming Guo, et al. · 3
Study on Laser Dressing of Superabrasive Grinding Wheels
2000 · Kang Renke · Zhongguo jixie gongcheng · 3
Dynamic mechanical properties and constitutive model of Fe-36Ni invar alloy at high temperature and high strain rate
2010 · Kang Renke · Materials Science and Technology · 2
The novel damage evolution mechanism induced by scratch interference behavior
2026 · Hui Zhang, Renke Kang, et al. · International Journal of Mechanical Sciences · 1
Recent Progress of Cleaning Technologies and Cleanliness Evaluation Methods for Metal Substrates
2023 · ZHAO Yong, GUO Jiang, et al. · Journal of Mechanical Engineering · 1
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Structural Design and Accuracy Analysis of Coaxiality Adjustment Platform
2020 · Zhu Xiang-long, Jianbo Li, et al. · Modular Machine Tool & Automatic Manufacturing Technique · 1
Experiments of Laser Cutting of Aluminum Alloy Sheet Based on Vaporization-Melt Ratio Controlled Method
2010 · 王续跃 Wang Xuyue, 孟庆轩 Meng Qingxuan, et al. · Chinese Journal of Lasers · 1
The Role of Friction Chemical Reaction Activation Energy in SiO_2-CMP
2010 · Kang Renke · Nanotechnology and Precision Engineering · 1
Subsurface Damage in the Monocrystal Silicon Grinding on Atomic Scale
2007 · Guo Xiaoguang, Dongming Guo, et al. · 1
Study on Process Parameters for Radome Inner Surface Precision Grinding With Electroplated Diamond Wheel
2004 · Ji Feng Tian, Dongming Guo, et al. · Diamond & Abrasives Engineering · 1
Formation, modelling and suppression of surface waviness profile in wafer self-rotation grinding
2026 · Tianyu Li, Xianglong Zhu, et al. · Precision Engineering
Damage evolution of glass–ceramics under various loading modes
2026 · Hui Zhang, Renke Kang, et al. · International Journal of Mechanical Sciences
Works count: 64
Citation count: 277
H-index: 7
I10-index: 5
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