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Ted Lundquist

Observed names: T. Lundquist, T. R. LUNDQUIST, T. R. Lundquist, T.R. Lundquist
OpenAlex ID: A5113560459
Laser Voltage Imaging: A New Perspective of Laser Voltage Probing
2010 · Yin S. Ng, Ted Lundquist, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 47
Fault localization using time resolved photon emission and stil waveforms
2004 · N. Nataraj, T. Lundquist, et al. · IEEE International Test Conference (ITC) · 28
Physical Techniques for Chip-Backside IC Debug in Nanotechnologies
2008 · Christian Boit, Rudolf Schlangen, et al. · IEEE Design & Test of Computers · 26
Dynamic lock-in thermography for operation mode-dependent thermally active fault localization
2010 · R. Schlangen, H. Deslandes, et al. · Microelectronics Reliability · 19
Octave-spanning super-continuum from a silica photonic crystal fiber pumped by a 386 MHz Yb:fiber laser
2012 · C. Farrell, K. A. Serrels, et al. · Optics Letters · 18
High-resolution subsurface microscopy of CMOS integrated circuits using radially polarized light
2015 · M. Rutkauskas, C. Farrell, et al. · Optics Letters · 17
Physical IC debug – backside approach and nanoscale challenge
2008 · C. Boit, R. Schlangen, et al. · Advances in radio science · 15
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Quantitative hydrogen depth-profiling using SIMS
1981 · T.R. Lundquist, R.P. Burgner, et al. · Applications of Surface Science · 15
Practical, non-invasive optical probing for flip-chip devices
2002 · G. Dajee, N. Goldblatt, et al. · IEEE International Test Conference (ITC) · 11
Solid-immersion-lens-enhanced nonlinear frequency-variation mapping of a silicon integrated-circuit
2011 · K. A. Serrels, C. Farrell, et al. · Applied Physics Letters · 9
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing
2009 · R. Schlangen, R. Leihkauf, et al. · Microelectronics Reliability · 9
IC Diagnostic with Time Resolved Photon Emission and CAD Auto-Channeling
2003 · Romain Desplats, Alban Eral, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 9
Novel NIR Camera with Extended Sensitivity and Low Noise for Photon Emission Microscopy of VLSI Circuits
2014 · Andrea Bahgat Shehata, Franco Stellari, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 8
Near-infrared photon emission spectroscopy of a 45 nm SOI ring oscillator
2012 · Ulrike Kindereit, Alan J. Weger, et al. · IEEE International Reliability Physics Symposium proceedings · 8
RF performance increase allowing IC timing adjustments by use of backside FIB processing
2009 · Rudolf Schlangen, Rainer Leihkauf, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 8
Creation of Solid Immersion Lenses in Bulk Silicon Using Focused Ion Beam Backside Editing Techniques
2008 · P. Scholz, U. Kerst, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 7
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy
2007 · R. Schlangen, U. Kerst, et al. · Microelectronics Reliability · 7
Circuit editing of copper and low‐k dielectrics in nanotechnology devices
2004 · F. MOSSELVELD, V. V. MAKAROV, et al. · Journal of Microscopy · 7
A Superconducting Nanowire Single-Photon Detector (SnSPD) System for Ultra Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuits
2013 · Franco Stellari, Alan J. Weger, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 6
FIB Backside Circuit Modification at the Device Level, Allowing Access to Every Circuit Node with Minimum Impact on Device Performance by Use of Atomic Force Probing
2007 · R. Schlangen, U. Kerst, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 6
Reducing focused ion beam charging effects on insulators by heating: A practical method for TEM specimen preparation of nonconductors
1988 · T.R. Lundquist, R. Alani, et al. · Ultramicroscopy · 6
Time-integrated photon emission as a function of temperature in 32 nm CMOS
2015 · Andrea Bahgat Shehata, Alan J. Weger, et al. · IEEE International Reliability Physics Symposium proceedings · 5
Ultra-Low Voltage Time-Resolved Emission Measurements from 32 nm SOI CMOS Integrated Circuits
2014 · Andrea Bahgat Shehata, Franco Stellari, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 5
Measuring propagation delays of critical paths using time-resolved LADA
2014 · K. Erington, D. Bodoh, et al. · IEEE International Reliability Physics Symposium proceedings · 5
Optical Probing of FinFETs
2013 · J. Fine, C.D. Young, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 5
Works count: 87
Citation count: 399
H-index: 9
I10-index: 9
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