Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Chih Wei Wu
Observed names:
Chih -Wei Wu,
Chih-Wei Wu
Institution:
Chung Hua University
Observed institutions:
National United University,
National Sun Yat-sen University,
National Chung Cheng University,
National Taiwan Ocean University,
Chung Hua University
OpenAlex ID:
A5113628054
An integrated structural model toward successful continuous improvement activity
2005
·
Chih Wei Wu
, Chyong Ling Chen
·
Technovation
·
103
Temperature dependence of refractive index in blue phase liquid crystals
2013
·
Chun-Wei Chen
, Hung-Chang Jau
, et al.
·
Optical Materials Express
·
36
Anti-adhesive effects of diverse self-assembled monolayers in nanoimprint lithography
2006
·
Chih-Wei Wu
, Yung-Kang Shen
, et al.
·
Sensors and Actuators A Physical
·
28
Study on cellar behaviors on different nanostructures by nanoporous alumina template
2014
·
Chiung-Fang Huang
, Hsin-Chung Cheng
, et al.
·
International Journal of Precision Engineering and Manufacturing
·
12
A new focus on overcoming the improvement failure
2003
·
Chih Wei Wu
, Chyong Ling Chen
·
Technovation
·
12
The Integrated Packaging Process for Optical Sensor and RFID Used in Harsh Environment Conditions
2007
·
Chih Wei Wu
, Yung Kang Shen
, et al.
·
Key engineering materials
·
2
Detection of Low-Contrast Defects in Optical Films Using Sigma-Based Segmentation Technique
2015
·
Yih Chih Chiou
, Chih Wei Wu
·
Key engineering materials
·
1
Surface Modification of Plastic Thin Film Using Anodic Aluminum Oxide Template for Nano Imprint
2010
·
Chih Wei Wu
, Jeou Long Lee
, et al.
·
Key engineering materials
·
1
Nitrogen and Bias Effect on Homoepitaxial Diamond Growth by Hot-Filament Chemical Vapor Deposition
2010
·
Hung Yin Tsai
, Chih Cheng Chang
, et al.
·
Key engineering materials
·
1
Study on Micro-Feature of Backlight Module for Micro Injection Molding Technology
2007
·
Yung Kang Shen
, Yi Lin
, et al.
·
Key engineering materials
·
1
The Integrated Packaging Process for Optical Sensor and RFID Used in Harsh Environment Conditions
2007
·
Chih Wei Wu
, Yung Kang Shen
, et al.
·
Key engineering materials
·
1
Fabrication of a metal mold with microstructures using a novel passive-alignment recombining technique
2007
·
Chih -Wei Wu
, Jin -Rong Tsai
, et al.
·
Journal of Mechanical Science and Technology
·
1
A Novel Structural Design of Heat-Dissipation Method for High Brightness LED Lighting with Thermoelectric Chip Module
2014
·
Ching Wu Wang
, Ti Chun Yeh
, et al.
·
Advanced materials research
Fabrication of a Large-Area Silicon Mold with Microstructures Using a Novel Recombining Technique
2010
·
Chih Wei Wu
, Chih Heng Chi
, et al.
·
Key engineering materials
Precision Transfer and Replication of Ultrasonic Nanoimprint
2008
·
Chiung Fang Huang
, Jeou Long Lee
, et al.
·
Advanced materials research
The Study of Fabrication of the Liquid Core Waveguide Nutrient Sensor
2007
·
Chih Wei Wu
, Yung Kang Shen
, et al.
·
Key engineering materials
Study on Micro-Feature of Backlight Module for Micro Injection Molding Technology
2007
·
Yung Kang Shen
, Yi Lin
, et al.
·
Key engineering materials
The Study of Fabrication of the Liquid Core Waveguide Nutrient Sensor
2007
·
Chih Wei Wu
, Yung Kang Shen
, et al.
·
Key engineering materials
Show more works
View as search
Works count:
18
Citation count:
199
H-index:
5
I10-index:
5
Year
Topic
Type
