Author

Stephen Olson

Observed names: Olson, Stephen, S. Olson, S. R. Olson, S.R. Olson

Observed institutions: University at Albany, State University of New York, TRW (United States), SUNY Polytechnic Institute

OpenAlex ID: A5113676962

A TDDB model of Si/sub 3/N/sub 4/-based capacitors in GaAs MMICs

2003 · J. Scarpulla, D.C. Eng, et al. · IEEE International Reliability Physics Symposium proceedings · 25

Dielectric breakdown, defects and reliability in SiN MIMCAPs

2002 · J. Scarpulla, E.D. Ahlers, et al. · GaAs Reliability Workshop · 21

0.1 μm InGaAs/InAlAs/InP HEMT MMICs - a flight qualified technology

2003 · Y.C. Chou, D. Leung, et al. · Technical digest -- IEEE Compound Semiconductor Integrated Circuit Symposium · 20

On the technology and ecosystem of 3D / TSV manufacturing

2011 · Klaus Hummler, Larry Smith, et al. · ASMC proceedings · 14

(Invited) Materials and Processes for Superconducting Qubits and Superconducting Electronic Circuits on 300mm Wafers

2018 · Satyavolu S. Papa Rao, Christopher Hobbs, et al. · ECS Transactions · 5

Multiwafer molecular beam epitaxy for high volume production of GaAs/AlGaAs heterojunction bipolar transistor wafers

1998 · T. R. Block, M. Wojtowicz, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 5

Ultrathin TaN Damascene Nanowire Structures on 300-mm Si Wafers for Quantum Applications

2023 · Ekta Bhatia, Jack Lombardi, et al. · IEEE Transactions on Quantum Engineering · 4

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A novel optical component for the development of an integrated interferometric system

2009 · A. Gracias, N. Tokranova, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Future trends of HBT technology for commercial and defense applications

2002 · A.K. Oki, D.C. Streit, et al. · IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications · 3

Reliable ICs fabricated using a production GaAs HBT process for military and commercial applications

2002 · F.M. Yamada, A.K. Oki, et al. · IEEE Military Communications Conference (MILCOM) · 3

Simple Method for Calculating Backside Via Inductance

2001 · R. Tsai, W. Okamura, et al. · 3

Manufacturable 300mm Wafer Thinning for 3D Interconnect Applications

2010 · Jamal Qureshi, Raymond Caramto, et al. · MRS Proceedings · 2

Heterojunction acoustic charge transport for transversal filter applications

2002 · S. Olson, E. Garber, et al. · IEEE International Ultrasonics Symposium · 2

Integrated cantilever development for ultrasonic and acoustic scanning probe microscopy

2006 · Stephen Olson, Balasubramanian Sankaran, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 1

Scalable fabrication of quantum technologies

2026 · Ekta Bhatia, Zhihao Xiao, et al. · SPIE Quantum Information Science, Sensing, and Computation

Ta-based Josephson junctions using insulating ALD TaN tunnel barriers

2025 · Bhatia, Ekta, Lombardi, Jack, et al. · arXiv (Cornell University)

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Oxidation Kinetics of Superconducting Niobium and a-Tantalum in Atmosphere at Short and Intermediate Time Scales

2024 · Frost, Hunter J., Bhatia, Ekta, et al. · arXiv (Cornell University)

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Transport Properties of NbN-Cu Bilayer Superconducting Nanowires

2024 · Archit Shah, Soumen Kar, et al. · IEEE Transactions on Applied Superconductivity

Integrated cantilever fabrication and system development for ultrasonic and acoustic scanning probe microscopy

2005 · Stephen Olson, Balasubramanian Sankaran, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

Impact of Backside Via Dimension Changes on High Frequency GaAs MMIC Circuit Performance

2003 · Peter Nam, R. Tsai, et al.

0.1 pm InGaAs/lnAIAs/lnP HEMT MMlCs -a Flight Qualified Technology

2002 · Y.C. Chou, D. Leung, et al.

Works count: 21

Citation count: 111

H-index: 5

I10-index: 4