Author

Kexin Wei

2024 · Kexin Wei, Yang Shi, et al. · Advances in Colloid and Interface Science · 118
2017 · Zhen Hu, Mingxing Du, et al. · IEEE Transactions on Device and Materials Reliability · 82
2018 · Zhen Hu, Mingxing Du, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 75
2021 · Qiang Sun, Haiying Lv, et al. · IEEE Transactions on Applied Superconductivity · 63
2020 · Mingxing Du, Qiuya Guo, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 52
2020 · Mingxing Du, Jinlei Xin, et al. · IEEE Transactions on Electron Devices · 40
2021 · Jinlei Xin, Mingxing Du, et al. · IEEE Transactions on Electron Devices · 38
2019 · Mingxing Du, Yu Tang, et al. · IEEE Transactions on Device and Materials Reliability · 38
2019 · Lei Jing, Mingxing Du, et al. · IEEE Transactions on Electron Devices · 36
2019 · Lei Jing, Mingxing Du, et al. · IEEE Transactions on Electron Devices · 35
2019 · Kexin Wei, Wenbai Wang, et al. · IEEE Access · 33
2019 · Jiangyong Zhang, Mingxing Du, et al. · IEEE Transactions on Device and Materials Reliability · 27
2008 · Wei Ke-xin, Wang Shui-ming · International Conference on Advanced Computer Theory and Engineering · 23
2019 · Mingxing Du, Qingyi Kong, et al. · IEEE Transactions on Electron Devices · 20
2019 · Qiang Sun, Haiying Lv, et al. · IEEE Transactions on Applied Superconductivity · 19
2020 · Wenbai Wang, Mingxing Du, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 17
2019 · Mingxing Du, Qiuya Guo, et al. · Case Studies in Thermal Engineering · 17
2019 · Qiang Sun, Haiying Lv, et al. · IEEE Transactions on Applied Superconductivity · 10
2008 · Kexin Wei, Qiang Sun, et al. · Pacific-Asia Workshop on Computational Intelligence and Industrial Application · 10
2021 · Mingxing Du, Jinlei Xin, et al. · Microelectronics Journal · 8
Works count: 77
Citation count: 1,260
H-index: 17
I10-index: 23
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