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Shu-Cheng Chang

Use of patterned laser liftoff process and electroplating nickel layer for the fabrication of vertical-structured GaN-based light-emitting diodes
2005 · Shui-Jinn Wang, Kai-Ming Uang, et al. · Applied Physics Letters · 115
Investigation of Au/Ti/Al ohmic contact to N-type 4H–SiC
2005 · Shu-Cheng Chang, Shui-Jinn Wang, et al. · Solid-State Electronics · 45
Integrated HfO2-RRAM to achieve highly reliable, greener, faster, cost-effective, and scaled devices
2017 · ChiaHua Ho, Shuo-Che Chang, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 37
Growth and characterization of tungsten carbide nanowires by thermal annealing of sputter-deposited WCx films
2004 · Shui-Jinn Wang, Chao-Hsuing Chen, et al. · Applied Physics Letters · 27
Design and fabrication of high breakdown voltage 4H-SiC Schottky barrier diodes with floating metal ring edge terminations
2004 · Shu-Cheng Chang, Shui-Jinn Wang, et al. · Solid-State Electronics · 22
On the thermal annealing conditions for self-synthesis of tungsten carbide nanowires from WCx films
2005 · Shui-Jinn Wang, Chao-Hsuing Chen, et al. · Nanotechnology · 12
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A review of the etched terminal structure of a 4H-SiC PiN diode
2023 · Hang Zhou, Jingrong Yan, et al. · Journal of Semiconductors · 8
A Channel Self-Alignment process for High-Voltage VDMOSFETs in 4H-SiC
2021 · Huan Ge, Tao Zhu, et al. · Journal of Physics Conference Series · 6
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A Vertical-Structured Ni/GaN Schottky Barrier Diode Using Electroplating Nickel Substrate
2006 · Shui-Jinn Wang, Tron-Min Chen, et al. · Japanese Journal of Applied Physics · 5
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A Short Channel Self-Alignment Process for High-Voltage VDMOSFETs in 4H-SiC
2023 · Bingke Zhang, Tao Zhu, et al. · China International Forum on Solid State Lighting & International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS) · 2
Applying express-queue-based approach to Software Reliability and cost analysis
2016 · Shu-Cheng Chang, Chin-Yu Huang, et al. · IEEE International Conference on Signal Processing, Communications and Computing (ICSPCC) · 2
Vertical-structured Ni/n-GaN schottky diode with electroplating nickel substrate
2005 · Shui-Jinn Wang, Shu-Cheng Chang, et al. · Conference digest · 2
Analysis of pressure cook test failure of 1200V silicon carbide diodes
2025 · Xiping Niu, Kaixuan Xu, et al. · International Conference on Electrical Engineering and Smart Grid (EESG)
Works count: 13
Citation count: 283
H-index: 7
I10-index: 6
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