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Ting Jian
Observed name:
Ting Yu Jian
Institution:
Suqian University
Observed institutions:
Advanced Semiconductor Engineering (Taiwan),
Suqian University
OpenAlex ID:
A5114040728
Grain boundary-induced stress localization during compression deformation of polycrystalline 316L stainless steel
2024
·
Zhanfeng Wang
, Sai Tao
, et al.
·
Applied Physics A
·
11
Superimposed reverse diamond turning of polycrystalline copper for ultra-precision optical surface finish
2025
·
Sai Tao
, Zhanfeng Wang
, et al.
·
Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science
·
5
Optimization of Process Parameters for Molding Simulation of Open Cavity QFN
2022
·
Shih Kun Lo
, Ting Yu Jian
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
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Works count:
3
Citation count:
20
H-index:
3
I10-index:
1
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