Get started
Author

Yi Liu

The origin of low thermal expansion coefficient and enhanced tensile properties of Invar alloy fabricated by directed energy deposition
2023 · Genghao Jiao, Xuewei Fang, et al. · Journal of Materials Processing Technology · 46
Nanochannels with a 18-nm feature size and ultrahigh aspect ratio on silica through surface assisting material ejection
2022 · Yu Lu, Lin Kai, et al. · Advanced Photonics Nexus · 26
PDF
In Situ Diagnosis for IGBT Chip Failure in Multichip IGBT Modules Based on a Newly Defined Characteristic Parameter Low-Sensitive to Operation Conditions
2023 · Jianpeng Wang, Wenjie Chen, et al. · IEEE Transactions on Power Electronics · 22
An Accurate and Intelligent Approach to Predicting the Power Device Fatigue Failure Process
2023 · Yi Liu, Lixin Jia, et al. · IEEE Transactions on Power Electronics · 16
A Novel Condition Monitoring Method for Full Modes of Package Degradation in High Power Modules Based on Hysteresis Curves of Forward Voltage Drop
2024 · Yuchen Wang, Hong Zhang, et al. · IEEE Transactions on Power Electronics · 11
Hybrid Data-Driven and Mechanistic Modeling Approach for Power Module Rapid Thermal Analysis
2024 · Jin Zhang, Laili Wang, et al. · IEEE Transactions on Power Electronics · 8
A Framework for End-to-End Differentiated Services QoS Context Transfer in Mobile IPv6
2006 · Chuda Liu, Depei Qian, et al. · International Conference in Central Asia on Internet · 5
A Novel Artificial Intelligence-Enabled Junction Temperature Estimation Method for Multiple Chips in a SiC Power Module Based on an Inherent Built-in NTC Sensor
2025 · Zhewei Zhang, Laili Wang, et al. · IEEE Transactions on Power Electronics · 3
SiC MOSFET Power Module With a Compact Spatially Symmetric Double-Sided Embedded Packaging Method for High-Temperature Applications up to 500 °C
2026 · Mengyu Zhu, Laili Wang, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2
Measurement of Roller Skew Based on Separated Responses of Ultrasonic Sensors
2025 · Rui Zhou, Yi Liu, et al. · IEEE Sensors Journal · 2
Enhanced ablation resistance of pressureless liquid-phase sintered SiC ceramics via (Hf0.2Zr0.2Ta0.2Nb0.2Ti0.2)B2 addition
2025 · Yi Liu, Wei-Ming Guo, et al. · Ceramics International · 2
Power cycling method of power semiconductor devices based on mission profiles
2021 · Jin Zhang, Jianpeng Wang, et al. · IEEE International Power Electronics and Application Symposium (PEAS) · 2
Image method for measuring normal interfacial stiffness
2016 · Yi Liu, Heng Liu, et al. · Proceedings of the Institution of Mechanical Engineers Part J Journal of Engineering Tribology · 2
Ultrasonic Monitoring Roller Load Variation Induced by Roller Wear
2024 · Rui Zhou, Li Chen, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 1
Modern Architecture in Shanbei Influenced by Regional Environment
2013 · Yao Li Lei, Yi Liu · Advanced materials research · 1
A Novel Analytic Approach to Calculating Thermal Resistance of the Power Device in Power Systems
2025 · Yi Liu, Xiaobo Dong, et al. · IEEE International Conference on Smart Power and Energy Technologies (SPET)
A Rapid Thermal Analysis Approach for Power Module Design Considering Non-Linear Thermal Conductivity
2024 · Jin Zhang, Yi Liu, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Profiling a Cylindrical Roller Bearing Oil-Film Thickness Distribution With Ultrasound
2015 · Meng Li, Li Chen, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE)
Solving Network Testbed Mapping Problem with Genetic Algorithm
2006 · Yi Liu, Kaiping Xiao, et al. · Springer eBooks
Works count: 19
Citation count: 149
H-index: 6
I10-index: 5
Year
Topic
Type