2024 · Nidheesh Puliyath, Huxiao Xie, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
2024 · Nakul Kothari, Karthikeyan Dhandapani, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)