Author

Nidheesh Puliyath

Observed institution: Qualcomm (United States)
OpenAlex ID: A5114620283
2024 · Nidheesh Puliyath, Huxiao Xie, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
2024 · Nakul Kothari, Karthikeyan Dhandapani, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Works count: 3
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