Author

Derek Mong

OpenAlex ID: A5121664076

Hybrid Qualification in Virtual Factory: A Data-Driven Framework for Cross-Site Manufacturing Consistency

2026 · Jane Li, Wei Wang, et al. · International Conference on Electronic Packaging Technology (ICEPT)

Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics

2025 · Muralidharan Sundararajan, Mutharasu Devarajan, et al. · Microelectronics International

Works count: 2

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