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Author

Yanyan Hu

Institution: Fudan University
Observed institution: Fudan University
ORCID: 0009-0003-7379-9642
Observed ORCID: 0009-0003-7379-9642
OpenAlex ID: A5123528702
Thermal and Mechanical Reliability of TIM1 in FCBGA Using a Simplified Sandwich Model
2025 · Yanyan Hu, Siliang Fei, et al. · IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) · 1
Highly Thermally Conductive Epoxy Composite With Small‐Sized Boron Nitride/Alumina Hybrid Fillers for Fine‐Pitch Underfill Application
2026 · Jiou Zhang, Jiaao Yu, et al. · Journal of Applied Polymer Science
An Area-Integral and Effective-Medium-Theory Model for Thermal Conductivity in Multiphase Composite Materials
2026 · Yanyan Hu, Yuqing Lu, et al. · SSRN Electronic Journal
Works count: 3
Citation count: 1
H-index: 1
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