Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Changqing Liu
Institution:
Huazhong University of Science and Technology
Observed institution:
Huazhong University of Science and Technology
ORCID:
0000-0002-5398-6171
Observed ORCID:
0000-0002-5398-6171
OpenAlex ID:
A5146830552
Development of high-thermal conductive Ag@diamond composite sintering paste and its application in power modules
2026
·
Chunhua Zhang
, Canyu Liu
, et al.
·
Applied Physics Letters
·
2
Thermal-shock reliability of sintered Ag@diamond composites used as thermal interface materials for power devices
2026
·
Chunhua Zhang
, Canyu Liu
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Fabrication of Multilayer Circuit on DPC Ceramic Substrate with Polyimide
2026
·
Zhenyu Lei
, Mingxiang Chen
, et al.
·
International Conference on Electronic Packaging Technology (ICEPT)
Ga-Based Liquid Metals: Advances in Interface Thermal and Electrical Regulations for Power Electronics Integration
2026
·
Canyu Liu
, Canyu Liu
, et al.
·
Materials
PDF
Show more works
View as search
Works count:
6
Citation count:
2
H-index:
1
I10-index:
Year
Topic
Type
