Keyword

3D integration

Description: Integration in three dimensions is the mathematical operation of accumulating a function over a three-dimensional domain; the term may also denote other concepts.

Primary topic: 3D IC and TSV technologies (57%)

Related topic: 3D IC and TSV technologies (57%)

OpenAlex ID: keywords/3d-integration

A multicenter numerical integration scheme for polyatomic molecules

1988 · A. D. Becke · The Journal of Chemical Physics · 2,731

Efficient molecular numerical integration schemes

1995 · Oliver Treutler, Reinhart Ahlrichs · The Journal of Chemical Physics · 2,529

Vertically stacked multi-heterostructures of layered materials for logic transistors and complementary inverters

2012 · Woo Jong Yu, Zheng Li, et al. · Nature Materials · 934

Three-dimensional integrated stretchable electronics

2018 · Zhenlong Huang, Yifei Hao, et al. · Nature Electronics · 550

Interconnect limits on gigascale integration (GSI) in the 21st century

2001 · J.A. Davis, R. Venkatesan, et al. · Proceedings of the IEEE · 512

Three-dimensional silicon integration

2008 · J. U. Knickerbocker, P. S. Andry, et al. · IBM Journal of Research and Development · 504

Through-Silicon Via (TSV)

2009 · Makoto Motoyoshi · Proceedings of the IEEE · 483

3-D Topologies for Networks-on-Chip

2007 · Vasilis F. Pavlidis, Eby G. Friedman · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 394

Recent Progress in Phase-ChangeMemory Technology

2016 · Geoffrey W. Burr, Matthew J. BrightSky, et al. · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 392

Single-electron transistors: Electrostatic analogs of the DC SQUIDS

1987 · K. Likharev · IEEE Transactions on Magnetics · 370

Handbook of 3D Integration

2008 · Wiley eBooks · 364

The structural simulation toolkit

2011 · A. F. Rodrigues, K. S. Hemmert, et al. · ACM SIGMETRICS Performance Evaluation Review · 340

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Future system-on-silicon LSI chips

1998 · M. Koyanagi, H. Kurino, et al. · IEEE Micro · 337

Three-dimensional integration of two-dimensional field-effect transistors

2024 · Darsith Jayachandran, Rahul Pendurthi, et al. · Nature · 329

Femtosecond laser microstructuring: an enabling tool for optofluidic lab‐on‐chips

2011 · R. Osellame, H.J.W.M. Hoekstra, et al. · Laser & Photonics Review · 320

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3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

2009 · Jian-Qiang Lu · Proceedings of the IEEE · 319

3D-Integrated metasurfaces for full-colour holography

2019 · Yueqiang Hu, Xuhao Luo, et al. · Light Science & Applications · 311

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Vertical full-colour micro-LEDs via 2D materials-based layer transfer

2023 · Jiho Shin, Hyunseok Kim, et al. · Nature · 302

High-Density Through Silicon Vias for 3-D LSIs

2009 · Mitsumasa Koyanagi, Takafumi Fukushima, et al. · Proceedings of the IEEE · 301

3D Arrays of 1024‐Pixel Image Sensors based on Lead Halide Perovskite Nanowires

2016 · Leilei Gu, Mohammad Mahdi Tavakoli, et al. · Advanced Materials · 300

Roadmap for 22nm and beyond (Invited Paper)

2009 · H. Iwai · Microelectronic Engineering · 300

Processor Design in 3D Die-Stacking Technologies

2007 · Gabriel H. Loh, Yuan Xie, et al. · IEEE Micro · 292

Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication

2021 · Michael Huff · Micromachines · 287

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Three-dimensional monolithic integration in flexible printed organic transistors

2018 · Jimin Kwon, Yasunori Takeda, et al. · Nature Communications · 286

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Challenges and Applications of Emerging Nonvolatile Memory Devices

2020 · Writam Banerjee · Electronics · 275

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Works count: 7,653

Citation count: 77,740