Keyword

3D packaging

Description: Three-dimensional packaging is an electronics integration approach that stacks or connects components and device layers vertically to create compact electronic modules.

Primary topic: 3D IC and TSV technologies (60%)

OpenAlex ID: keywords/3d-packaging

Reliability challenges in 3D IC packaging technology

2010 · K.N. Tu · Microelectronics Reliability · 657

3D Printing for the Rapid Prototyping of Structural Electronics

2014 · Eric Macdonald, Rudy Salas, et al. · IEEE Access · 606

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Hybrid memory cube new DRAM architecture increases density and performance

2012 · Joe Jeddeloh, Brent Keeth · Symposium on VLSI Technology · 446

A review of 3-D packaging technology

1998 · S.F. Al-Sarawi, D. Abbott, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 383

DRAMsim3: A Cycle-Accurate, Thermal-Capable DRAM Simulator

2020 · Shang Li, Zhiyuan Yang, et al. · IEEE Computer Architecture Letters · 341

InFO (Wafer Level Integrated Fan-Out) Technology

2016 · Chien-Fu Tseng, Chung-Shi Liu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 284

SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade

2004 · R.R. Tummala · IEEE Transactions on Advanced Packaging · 274

Handbook of 3D integration : technology and applications of 3D integrated circuits

2012 · Philip E. Garrou, Christopher A. Bower, et al. · 226

Automotive Power Module Packaging: Current Status and Future Trends

2020 · Yuhang Yang, Lea Dorn-Gomba, et al. · IEEE Access · 207

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The 3-D Interconnect Technology Landscape

2016 · Eric Beyne · IEEE Design and Test · 184

Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA

2011 · Bahareh Banijamali, Suresh Ramalingam, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 182

Encapsulation Technologies for Electronic Applications

2018 · Elsevier eBooks · 158

Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring

2008 · Masahiro Sunohara, Takayuki Tokunaga, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 158

Advanced Electronic Packaging

2006 · Richard K. Ulrich, William D. Brown · Institute of Electrical and Electronics Engineers eBooks · 147

3D Packaging for Heterogeneous Integration

2022 · Rahul Agarwal, Patrick Cheng, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 131

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

2020 · Mu-lan Li, Liang Zhang, et al. · Materials & Design · 122

Integrated circuit packaging review with an emphasis on 3D packaging

2017 · Austin Lancaster, Manish Keswani · Integration · 114

High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions

2017 · Sayan Seal, Homer Mantooth · Energies · 101

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Influence of Bosch Etch Process on Electrical Isolation of TSV Structures

2011 · Nagarajan Ranganathan, Da Yong Lee, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 100

Status and prospects for phosphor-based white LED packaging

2009 · Zongyuan Liu, Sheng Liu, et al. · Frontiers of Optoelectronics in China · 100

Modeling and Simulation for Microelectronic Packaging Assembly

2011 · Sheng Liu, Yong Liu · Wiley eBooks · 95

Instant fabrication and selection of folded structures using drop impact

2011 · Arnaud Antkowiak, Basile Audoly, et al. · Proceedings of the National Academy of Sciences · 93

Three-dimensional packaging for power semiconductor devices and modules

2005 · J.N. Calata, J.G. Bai, et al. · IEEE Transactions on Advanced Packaging · 93

Design of an LTCC Tri-Band Transceiver Module for GPRS Mobile Applications

2004 · Y.-S. Lin, C.-C. Liu, et al. · IEEE Transactions on Microwave Theory and Techniques · 91

Mechanical and barrier properties of cardboard and 3D packaging coated with microfibrillated cellulose

2013 · Nathalie Lavoine, Julien Bras, et al. · Journal of Applied Polymer Science · 90

Works count: 2,714

Citation count: 18,910