Keyword

3D stacking

Description: A packaging and integration technique that vertically stacks electronic or microsystem components to increase density and enable compact systems.

Primary topic: 3D IC and TSV technologies (48%)

Related topic: 3D IC and TSV technologies (48%)

OpenAlex ID: keywords/3d-stacking

Polymer‐Based Resistive Memory Materials and Devices

2013 · Wen‐Peng Lin, Shu‐Juan Liu, et al. · Advanced Materials · 519

PIM-enabled instructions

2015 · Junwhan Ahn, Sungjoo Yoo, et al. · Proceedings - International Symposium on Computer Architecture/Proceedings · 436

Non-volatile resistive memory devices based on solution-processed ultrathin two-dimensional nanomaterials

2015 · Chaoliang Tan, Zhengdong Liu, et al. · Chemical Society Reviews · 345

PDF

Circuit and microarchitecture evaluation of 3D stacking magnetic RAM (MRAM) as a universal memory replacement

2008 · Xiangyu Dong, Xiaoxia Wu, et al. · Proceedings - ACM IEEE Design Automation Conference · 322

Photonic Potentiation and Electric Habituation in Ultrathin Memristive Synapses Based on Monolayer MoS2

2018 · Hui‐Kai He, Rui Yang, et al. · Small · 312

Three‐Dimensional Integration of Organic Resistive Memory Devices

2010 · Sunghoon Song, Byungjin Cho, et al. · Advanced Materials · 235

3D Cross‐Point Plasmonic Nanoarchitectures Containing Dense and Regular Hot Spots for Surface‐Enhanced Raman Spectroscopy Analysis

2016 · Jae Won Jeong, Md Masud Parvez Arnob, et al. · Advanced Materials · 221

A Reconfigurable 3-D-Stacked SPAD Imager With In-Pixel Histogramming for Flash LIDAR or High-Speed Time-of-Flight Imaging

2019 · Sam W. Hutchings, Nick Johnston, et al. · IEEE Journal of Solid-State Circuits · 206

SPADs and SiPMs Arrays for Long-Range High-Speed Light Detection and Ranging (LiDAR)

2021 · Federica Villa, Fabio Severini, et al. · Sensors · 192

PDF

Platform 2012, a many-core computing accelerator for embedded SoCs

2012 · Diego Melpignano, Luca Benini, et al. · Proceedings - ACM IEEE Design Automation Conference · 171

Extreme ultraviolet lithography and three dimensional integrated circuit—A review

2014 · Banqiu Wu, Ajay Kumar · Applied Physics Reviews · 158

PDF

3D-stackable crossbar resistive memory based on Field Assisted Superlinear Threshold (FAST) selector

2014 · Sung Hyun Jo, Tanmay Kumar, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 152

Challenges and recent prospectives of 3D heterogeneous integration

2022 · Shuye Zhang, Zhenfeng Li, et al. · e-Prime - Advances in Electrical Engineering Electronics and Energy · 147

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

2020 · Pascal Vivet, Eric Guthmuller, et al. · IEEE Journal of Solid-State Circuits · 132

Oxide Double‐Layer Nanocrossbar for Ultrahigh‐Density Bipolar Resistive Memory

2011 · Seo Hyoung Chang, Shin Buhm Lee, et al. · Advanced Materials · 120

Nanoscale resistive switching devices for memory and computing applications

2020 · Seung Hwan Lee, Xiaojian Zhu, et al. · Nano Research · 118

A 3D-IC Technology with Integrated Microchannel Cooling

2008 · Deepak Sekar, Calvin King, et al. · International Interconnect Technology Conference · 117

SpaceA: Sparse Matrix Vector Multiplication on Processing-in-Memory Accelerator

2021 · Xinfeng Xie, Zheng Liang, et al. · Proceedings - International Symposium on High-Performance Computer Architecture/Proceedings · 110

Cross-Point Resistive RAM Based on Field-Assisted Superlinear Threshold Selector

2015 · Sung Hyun Jo, Tanmay Kumar, et al. · IEEE Transactions on Electron Devices · 110

A survey of optimization techniques for thermal-aware 3D processors

2019 · Kun Cao, Junlong Zhou, et al. · Journal of Systems Architecture · 105

A 128 Gb 3b/cell V-NAND Flash Memory With 1 Gb/s I/O Rate

2015 · Woopyo Jeong, Jae-woo Im, et al. · IEEE Journal of Solid-State Circuits · 103

ATCache

2014 · Cheng-Chieh Huang, Vijay Nagarajan · International Conference on Parallel Architectures and Compilation Techniques · 103

Impact of 3D design choices on manufacturing cost

2009 · Dimitrios Velenis, Michele Stucchi, et al. · 97

Artificial Perception Built on Memristive System: Visual, Auditory, and Tactile Sensations

2019 · Xinglong Ji, Xinyu Zhao, et al. · Advanced Intelligent Systems · 93

PDF

A 256×256 45/65nm 3D-stacked SPAD-based direct TOF image sensor for LiDAR applications with optical polar modulation for up to 18.6dB interference suppression

2018 · Augusto Ronchini Ximenes, Preethi Padmanabhan, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 92

Works count: 1,053

Citation count: 11,630