Keyword

advanced packaging

Description: Advanced packaging comprises semiconductor packaging techniques that integrate multiple chips or components into a single functioning electronic package.

Primary topic: 3D IC and TSV technologies (39%)

Wikidata ID: wiki/Q110350723

OpenAlex ID: keywords/advanced-packaging

Millimeter-Wave Technology for Automotive Radar Sensors in the 77 GHz Frequency Band

2012 · Jürgen Hasch, Eray Topak, et al. · IEEE Transactions on Microwave Theory and Techniques · 1,374

Recent Advances and Trends in Advanced Packaging

2022 · John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 712

Adhesive wafer bonding

2006 · F. Niklaus, G. Stemme, et al. · Journal of Applied Physics · 473

Materials for Advanced Packaging

2008 · Daniel Lu, C.P. Wong · Springer eBooks · 303

Chiplet Heterogeneous Integration Technology—Status and Challenges

2020 · Tao Li, Jie Hou, et al. · Electronics · 230

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Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends

2021 · Kaladhar Radhakrishnan, Madhavan Swaminathan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 165

Challenges and prospects for advanced packaging

2023 · Zhiwen Chen, Jiaju Zhang, et al. · Fundamental Research · 151

Semiconductor Advanced Packaging

2021 · John H. Lau · Springer eBooks · 140

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

2023 · Haoyu Wang, Jianshe Ma, et al. · Micromachines · 134

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Modular Routing Design for Chiplet-Based Systems

2018 · Jieming Yin, Zhifeng Lin, et al. · ACM/IEEE International Symposium on Computer Architecture (ISCA) · 130

Biomimetic engineering of cellulose-based materials

2007 · Tuula T. Teeri, Harry Brumer, et al. · Trends in biotechnology · 123

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

2008 · P. S. Andry, C. K. Tsang, et al. · IBM Journal of Research and Development · 116

Materials for Advanced Packaging

2009 · Materials Today · 108

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Electroplated Copper Additives for Advanced Packaging: A Review

2024 · Lanfeng Guo, Shaoping Li, et al. · ACS Omega · 107

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A brief review of selected aspects of the materials science of ball bonding

2009 · C.D. Breach, F.W. Wulff · Microelectronics Reliability · 104

A 0.54 pJ/b 20 Gb/s Ground-Referenced Single-Ended Short-Reach Serial Link in 28 nm CMOS for Advanced Packaging Applications

2013 · John W. Poulton, William J. Dally, et al. · IEEE Journal of Solid-State Circuits · 94

Progress and application of through glass via (TGV) technology

2016 · Aric B. Shorey, Rachel Lu · Pan Pacific Microelectronics Symposium (Pan Pacific) · 74

High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

2024 · Shenggao Li, Mu-Shan Lin, et al. · IEEE Open Journal of the Solid-State Circuits Society · 71

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application

2023 · Yuan-Chiu Huang, Yu-Xian Lin, et al. · Nanomaterials · 69

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Advanced packaging of chiplets for future computing needs

2024 · Debendra Das Sharma, Ravi V. Mahajan · Nature Electronics · 64

Ultra-Low-Inductance Power Module for Fast Switching Semiconductors

2013 · Eckart Hoene, A. Ostmann, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 62

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review

2024 · Yongkun Wang, Haozheng Liu, et al. · Micromachines · 60

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Wafer-Scale Computing: Advancements, Challenges, and Future Perspectives [Feature]

2024 · Yang Hu, Xinhan Lin, et al. · IEEE Circuits and Systems Magazine · 55

Correlation between Ni3Sn4 intermetallics and Ni3P due to solder reaction-assisted crystallization of electroless Ni–P metallization in advanced packages

2000 · K. C. Hung, Y. C. Chan, et al. · Journal of materials research/Pratt's guide to venture capital sources · 54

Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

2023 · Hongfei Tao, Yuanhang Liu, et al. · Tribology International · 53

Works count: 1,835

Citation count: 10,300