Keyword

ball grid array

Description: A ball grid array is a surface-mount integrated-circuit package that connects a component to a circuit board through an array of solder balls.

Primary topic: Electronic Packaging and Soldering Technologies (74%)

Wikidata ID: wiki/Q570628

OpenAlex ID: keywords/ball-grid-array

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

2006 · Yi Li, C.P. Wong · Materials Science and Engineering R Reports · 715

Properties of lead-free solder alloys with rare earth element additions

2004 · C.M.L. Wu, D.Q. Yu, et al. · Materials Science and Engineering R Reports · 590

Effect of simulation methodology on solder joint crack growth correlation

2002 · R. Darveaux · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 553

Ball Grid Array Technology

1994 · John H. Lau · Medical Entomology and Zoology · 450

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

1996 · John H. Lau, Yi-Hsin Pao · Medical Entomology and Zoology · 443

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

2002 · Robert Darveaux · Journal of Electronic Packaging · 304

Effect of voids on the reliability of BGA/CSP solder joints

2003 · Mohammad Yunus, K. Srihari, et al. · Microelectronics Reliability · 154

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

2005 · S. K. Kang, P. Lauro, et al. · IBM Journal of Research and Development · 153

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

2010 · Da Yu, Abdullah Al-Yafawi, et al. · Microelectronics Reliability · 151

Effects of limited cu supply on soldering reactions between SnAgCu and Ni

2006 · C. E. Ho, Y. W. Lin, et al. · Journal of Electronic Materials · 145

Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow

2002 · D. Ma, W. D. Wang, et al. · Journal of Applied Physics · 143

Growth kinetics of intermetallic compounds in chip scale package solder joint

2001 · P.L Tu, Y.C Chan, et al. · Scripta Materialia · 140

LTCC Packages With Embedded Phased-Array Antennas for 60 GHz Communications

2011 · Dong Gun Kam, Duixian Liu, et al. · IEEE Microwave and Wireless Components Letters · 132

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

2003 · Bob Willis · Microelectronics International · 122

Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution

2023 · Sunwu Xu, Xinyi Jing, et al. · Materials Characterization · 118

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

2011 · Asit Kumar Gain, Y.C. Chan, et al. · Microelectronics Reliability · 118

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

2011 · Liang Yin, Luke Wentlent, et al. · Journal of Electronic Materials · 115

Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints

2004 · John H. L. Pang, Luhua Xu, et al. · Journal of Electronic Materials · 115

Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets

2011 · Dong Gun Kam, Duixian Liu, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 112

Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

2008 · Xuejun Fan, G.Q. Zhang, et al. · IEEE Transactions on Components and Packaging Technologies · 112

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

2004 · Jeong-Won Yoon, Sang-Won Kim, et al. · Journal of Alloys and Compounds · 111

Critical Variables of Solder Paste Stencil Printing for Micro-BGA and Fine-Pitch QFP

2004 · J. Pan, G.L. Tonkay, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 109

Effect of the drop impact on BGA/CSP package reliability

2002 · Kinuko Mishiro, Shigeo Ishikawa, et al. · Microelectronics Reliability · 105

Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

2005 · M. N. Islam, Ahmed Sharif, et al. · Journal of Electronic Materials · 96

The mechanics of the solder ball shear test and the effect of shear rate

2005 · Julian Yan Hon Chia, Brian Cotterell, et al. · Materials Science and Engineering A · 94

Works count: 4,136

Citation count: 25,740