Get started
Keyword

chiplets

Description: Chiplets are small, specialized integrated circuit dies combined within a package to form larger electronic systems, particularly in semiconductor and computer hardware design.
Wikidata ID: wiki/Q67060427
OpenAlex ID: keywords/chiplets
Recent Advances and Trends in Advanced Packaging
2022 · John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 712
Simba
2019 · Yakun Sophia Shao, Jason Clemons, et al. · Proceedings of the ... annual International Symposium on Microarchitecture/Proceedings of the annual International Symposium on Microarchitecture · 408
Chiplet Heterogeneous Integration Technology—Status and Challenges
2020 · Tao Li, Jie Hou, et al. · Electronics · 230
PDF
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level
2022 · Debendra Das Sharma, Gerald Pasdast, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 208
Pioneering Chiplet Technology and Design for the AMD EPYC™ and Ryzen™ Processor Families : Industrial Product
2021 · Samuel Naffziger, Noah Beck, et al. · ACM/IEEE International Symposium on Computer Architecture (ISCA) · 195
Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond
2021 · Xiaoxiong Gu, Duixian Liu, et al. · IEEE Journal of Microwaves · 174
PDF
TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O
2020 · Mark Wade, Erik Anderson, et al. · IEEE Micro · 155
Semiconductor Advanced Packaging
2021 · John H. Lau · Springer eBooks · 140
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management
2020 · Pascal Vivet, Eric Guthmuller, et al. · IEEE Journal of Solid-State Circuits · 132
3D Packaging for Heterogeneous Integration
2022 · Rahul Agarwal, Patrick Cheng, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 131
Modular Routing Design for Chiplet-Based Systems
2018 · Jieming Yin, Zhifeng Lin, et al. · ACM/IEEE International Symposium on Computer Architecture (ISCA) · 130
Fan-Out Wafer-Level Packaging
2018 · John H. Lau · Springer eBooks · 127
Cost-effective design of scalable high-performance systems using active and passive interposers
2017 · Dylan Stow, Yuan Xie, et al. · 124
High-performance, power-efficient three-dimensional system-in-package designs with universal chiplet interconnect express
2024 · Debendra Das Sharma, Gerald Pasdast, et al. · Nature Electronics · 106
PDF
Wafer Level System Integration of the Fifth Generation CoWoS®-S with High Performance Si Interposer at 2500 mm2
2021 · P. K. Huang, C. Y. Lu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 103
Kunpeng 920: The First 7-nm Chiplet-Based 64-Core ARM SoC for Cloud Services
2021 · Jing Xia, Chuanning Cheng, et al. · IEEE Micro · 100
A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing
2020 · Mu-Shan Lin, Tze-Chiang Huang, et al. · IEEE Journal of Solid-State Circuits · 96
System-in-package (SIP)
2000 · King L. Tai · Asia and South Pacific Design Automation Conference (ASP-DAC) · 88
Chiplet actuary
2022 · Yinxiao Feng, Kaisheng Ma · Proceedings - ACM IEEE Design Automation Conference · 82
PDF
Die Embedding Challenges for EMIB Advanced Packaging Technology
2021 · Gang Duan, Yosuke Kanaoka, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 81
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
2023 · John H. Lau · Journal of Electronic Packaging · 78
PDF
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers
2023 · John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 75
Multilayer RDL Interposer for Heterogeneous Device and Module Integration
2019 · Yi-Hang Lin, M.C. Yew, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 74
Design and Analysis of an APU for Exascale Computing
2017 · Thiruvengadam Vijayaraghavan, Arun Karunanithi, et al. · Proceedings - International Symposium on High-Performance Computer Architecture/Proceedings · 74
Ultra High Density SoIC with Sub-micron Bond Pitch
2020 · Y. H. Chen, C. A. Yang, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 73
Works count: 1,706
Citation count: 11,060
Year
Topic
Type