Keyword

Cu6Sn5

Description: Cu₆Sn₅ is a copper–tin intermetallic compound that forms in solder joints and other materials in the Cu–Sn system.

Primary topic: Electronic Packaging and Soldering Technologies (79%)

OpenAlex ID: keywords/cu6sn5

Introduction to ceramics

1961 · Journal of the Franklin Institute · 919

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

2000 · K. -W. Moon, W. J. Boettinger, et al. · Journal of Electronic Materials · 569

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

1996 · H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 503

Interdiffusion and reaction in bimetallic Cu-Sn thin films

1973 · K.N Tu · Acta Metallurgica · 486

Kinetics of interfacial reaction in bimetallic CuSn thin films

1982 · K.N. Tu, R.D. Thompson · Acta Metallurgica · 469

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

2010 · J.F. Li, P.A. Agyakwa, et al. · Acta Materialia · 402

Structure and properties of lead-free solders bearing micro and nano particles

2014 · Liang Zhang, K.N. Tu · Materials Science and Engineering R Reports · 325

Pb-free solders for flip-chip interconnects

2001 · D. R. Frear, J. W. Jang, et al. · JOM · 318

Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation

2004 · X Deng, N Chawla, et al. · Acta Materialia · 314

Li{sub x}Cu{sub 6}Sn{sub 5} (0

1999 · Keith D. Kepler, John T. Vaughey, et al. · Electrochemical and Solid-State Letters · 304

The superstructure of domain-twinned η'-Cu6Sn5

1994 · A.-K. Larsson, L. Stenberg, et al. · Acta Crystallographica Section B Structural Science · 275

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

2005 · H. Gan, K. N. Tu · Journal of Applied Physics · 273

The partial structure factors of liquid Cu-Sn

1966 · J. E. Enderby, D. M. North, et al. · Philosophical magazine · 260

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

2002 · T. Y. Lee, W. J. Choi, et al. · Journal of materials research/Pratt's guide to venture capital sources · 257

Influence of interfacial intermetallic compound on fracture behavior of solder joints

2003 · Hwa-Teng Lee, Ming-Hung Chen, et al. · Materials Science and Engineering A · 243

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

2006 · J.F. Li, S.H. Mannan, et al. · Acta Materialia · 231

Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

1995 · S. Bader, W. Gust, et al. · Acta Metallurgica et Materialia · 230

Electrochemical synthesis of ammonia from nitric oxide using a copper–tin alloy catalyst

2023 · Jiaqi Shao, Huijuan Jing, et al. · Nature Energy · 228

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

1999 · S. Choi, T. R. Bieler, et al. · Journal of Electronic Materials · 215

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

2007 · Brook Chao, Seung-Hyun Chae, et al. · Acta Materialia · 213

Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging

2004 · G. Ghosh · Journal of materials research/Pratt's guide to venture capital sources · 210

Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions

1998 · Sinn-Wen Chen, Chin-Ming Chen, et al. · Journal of Electronic Materials · 206

The crystallisation of Cu2ZnSnS4 thin film solar cell absorbers from co-electroplated Cu–Zn–Sn precursors

2008 · R. Schurr, A. Hölzing, et al. · Thin Solid Films · 205

Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys

2008 · Kazuhiro Nogita, Tetsuro Nishimura · Scripta Materialia · 205

Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

2008 · H.F. Zou, H.J. Yang, et al. · Acta Materialia · 203

Works count: 3,069

Citation count: 58,570