Keyword

die attach

Description: Die attach is the process of bonding a semiconductor chip to a substrate or package during electronic device assembly.

Primary topic: Electronic Packaging and Soldering Technologies (66%)

OpenAlex ID: keywords/die-attach

Mechanical properties of nano-silver joints as die attach materials

2011 · Kim S. Siow · Journal of Alloys and Compounds · 390

Survey of High-Temperature Reliability of Power Electronics Packaging Components

2014 · R. Khazaka, L. Mendizabal, et al. · IEEE Transactions on Power Electronics · 387

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material

2006 · J.G. Bai, Z.Z. Zhang, et al. · IEEE Transactions on Components and Packaging Technologies · 375

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

2007 · Tao Wang, Xu Chen, et al. · Journal of Electronic Materials · 345

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

2014 · Kim S. Siow · Journal of Electronic Materials · 317

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Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow

2002 · Z. Zhang, Guo-Quan Lu · IEEE Transactions on Electronics Packaging Manufacturing · 221

Heat-transfer microstructures for integrated circuits

1984 · David B. Tuckerman · 214

Automotive Power Module Packaging: Current Status and Future Trends

2020 · Yuhang Yang, Lea Dorn-Gomba, et al. · IEEE Access · 207

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Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °C

2016 · S.T. Chua, K.S. Siow · Journal of Alloys and Compounds · 206

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

2012 · S. Keyvaninia, M. Muneeb, et al. · Optical Materials Express · 193

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

2014 · R. Khazaka, L. Mendizabal, et al. · Journal of Electronic Materials · 191

Highly Conductive, Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

2012 · Zhuo Li, Rongwei Zhang, et al. · Advanced Functional Materials · 191

Defect detection on semiconductor wafer surfaces

2004 · N.G. Shankar, Z.W. Zhong · Microelectronic Engineering · 189

Moisture absorption and desorption predictions for plastic ball grid array packages

1997 · J.E. Galloway, B.M. Miles · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 188

Reliability assessment of sintered nano-silver die attachment for power semiconductors

2010 · Matthias Knoerr, Silke Kraft, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 182

High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment

2007 · John Guofeng Bai, Jian Yin, et al. · IEEE Transactions on Advanced Packaging · 177

Integration Technology of Micro-LED for Next-Generation Display

2023 · Dingbo Chen, Yu-Chang Chen, et al. · Research · 157

Reliability of Ag Sintering for Power Semiconductor Die Attach in High-Temperature Applications

2016 · Fang Yu, Jinzi Cui, et al. · IEEE Transactions on Power Electronics · 153

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

2016 · K. S. Siow, Y. T. Lin · Journal of Electronic Packaging · 153

Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules

2007 · L. Coppola, D. Huff, et al. · PESC record · 148

Die-attachment solutions for SiC power devices

2009 · R. Kisiel, Z. Szczepański · Microelectronics Reliability · 145

Thermal transient characteristics of die attach in high power LED PKG

2008 · Hyun-Ho Kim, Sang-Hyun Choi, et al. · Microelectronics Reliability · 145

Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices

2007 · John G. Bai, Jesus N. Calata, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 145

Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach

1997 · Pradeep Lall, Michael Pecht, et al. · Medical Entomology and Zoology · 137

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

2018 · Yue Gao, Wanli Li, et al. · Materials & Design · 134

Works count: 3,352

Citation count: 30,990