Keyword

direct bonding

Description: Direct bonding is a joining process that fuses material surfaces, particularly thermoplastic composites, without relying on a separate adhesive layer.

Primary topic: 3D IC and TSV technologies (21%)

OpenAlex ID: keywords/direct-bonding

Silicon-to-silicon direct bonding method

1986 · M. Shimbo, K. Furukawa, et al. · Journal of Applied Physics · 510

Wafer-to-wafer bonding for microstructure formation

1998 · M.A. Schmidt · Proceedings of the IEEE · 437

Tenfold reduction of Brownian noise in high-reflectivity optical coatings

2013 · Garrett D. Cole, Wei Zhang, et al. · Nature Photonics · 381

Magneto-optical isolator with silicon waveguides fabricated by direct bonding

2008 · Yuya Shoji, Tetsuya Mizumoto, et al. · Applied Physics Letters · 336

A posttreatment evaluation of direct bonding in orthodontics

1977 · Bjørn U. Zachrisson · American Journal of Orthodontics · 292

A modular microfluid system with an integrated micromixer

1996 · Norbert Schwesinger, Thomas Frank, et al. · Journal of Micromechanics and Microengineering · 233

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A universal direct bonding system for both metal and plastic brackets

1972 · Elliott Silverman, Morton Cohen, et al. · American Journal of Orthodontics · 230

Magneto-optical non-reciprocal devices in silicon photonics

2014 · Yuya Shoji, Tetsuya Mizumoto · Science and Technology of Advanced Materials · 220

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Clinical comparison of direct versus indirect bonding with different bracket types and adhesives

1978 · Björn U. Zachrisson, Björn O. Brobakken · American Journal of Orthodontics · 200

Long-term experience with direct-bonded lingual retainers.

1991 · E H Dahl, B U Zachrisson · PubMed · 180

Direct Bonding of Orthodontic Attachments to Teeth: The Relation of Adhesive Bond Strength to Gauze Mesh Size

1976 · I. R. Reynolds, J. A. von Fraunhofer · British Journal of Orthodontics · 170

Ceramic/metal joining for structural applications

1985 · M. G. Nicholas, D. A. Mortimer · Materials Science and Technology · 159

Review Article: recent advances in metal-ceramic brazing

2003 · R. M. do Nascimento, A. E. Martinelli, et al. · Cerâmica · 154

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3DVLSI with CoolCube process: An alternative path to scaling

2015 · P. Batude, C. Fenouillet-Beranger, et al. · Symposium on VLSI Technology · 145

Mid-infrared integrated waveguide modulators based on silicon-on-lithium-niobate photonics

2014 · Jeff Chiles, Sasan Fathpour · Optica · 141

Assessment of bracket placement and bond strength when comparing direct bonding to indirect bonding techniques

1982 · Michael J. Aguirre, Gregory J. King, et al. · American Journal of Orthodontics · 138

Effectiveness and efficiency of a CAD/CAM orthodontic bracket system

2015 · Matthew W. Brown, Lorne Koroluk, et al. · American Journal of Orthodontics and Dentofacial Orthopedics · 137

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Highly Efficient Wavelength Converter Using Direct-Bonded PPZnLN Ridge Waveguide

2010 · Takeshi Umeki, Osamu Tadanaga, et al. · IEEE Journal of Quantum Electronics · 134

The direct bonding of orthodontic attachments to teeth by means of an epoxy resin adhesive

1970 · D.H. Retief, C.J. Dreyer, et al. · American Journal of Orthodontics · 134

Comparison of the accuracy of bracket placement between direct and indirect bonding techniques

1999 · Bon Chan Koo, Chun-Hsi Chung, et al. · American Journal of Orthodontics and Dentofacial Orthopedics · 131

Low temperature bonding for microfabrication of chemical analysis devices

1997 · H.Y Wang, R.S Foote, et al. · Sensors and Actuators B Chemical · 130

Joining of C/SiC composites by spark plasma sintering technique

2013 · Stefano Rizzo, Salvatore Grasso, et al. · Journal of the European Ceramic Society · 124

Development of Advanced All-SiC Power Modules

2013 · Zhenxian Liang, Puqi Ning, et al. · IEEE Transactions on Power Electronics · 121

Direct Semiconductor Bonded 5J Cell for Space and Terrestrial Applications

2013 · P. T. Chiu, D. C. Law, et al. · IEEE Journal of Photovoltaics · 119

Direct-bonded GaAs∕InGaAs tandem solar cell

2006 · Katsuaki Tanabe, Anna Fontcuberta i Morral, et al. · Applied Physics Letters · 119

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Works count: 2,405

Citation count: 21,800