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Keyword

electromigration

Description: The movement of metal atoms caused by electrical current, a degradation process that affects the reliability of integrated-circuit interconnects.
Wikidata ID: wiki/Q1319010
OpenAlex ID: keywords/electromigration
Phase-Field Models for Microstructure Evolution
2002 · Long-Qing Chen · Annual Review of Materials Research · 2,998
Electromigration—A brief survey and some recent results
1969 · J.R. Black · IEEE Transactions on Electron Devices · 1,507
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2002 · K. Zeng, K.N. Tu · Materials Science and Engineering R Reports · 1,367
Electromigration in thin aluminum films on titanium nitride
1976 · I. A. Blech · Journal of Applied Physics · 1,251
Recent advances on electromigration in very-large-scale-integration of interconnects
2003 · K. N. Tu · Journal of Applied Physics · 1,064
Fabrication of metallic electrodes with nanometer separation by electromigration
1999 · Hongkun Park, Andrew K. L. Lim, et al. · Applied Physics Letters · 868
Electromigration in metals
1989 · P S Ho, T Kwok · Reports on Progress in Physics · 837
Models for contacts to planar devices
1972 · Microelectronics Reliability · 818
Design of High-Performance Microprocessor Circuits
2000 · Anantha Chandrakasan, William J. Bowhill, et al. · Institute of Electrical and Electronics Engineers eBooks · 794
Stress evolution due to electromigration in confined metal lines
1993 · M. A. Korhonen, P. Bo/rgesen, et al. · Journal of Applied Physics · 739
Photovoltaic Switching Mechanism in Lateral Structure Hybrid Perovskite Solar Cells
2015 · Yongbo Yuan, Jungseok Chae, et al. · Advanced Energy Materials · 712
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Electromigration failure modes in aluminum metallization for semiconductor devices
1969 · J.R. Black · Proceedings of the IEEE · 679
Electrokinetic remediation: Basics and technology status
1995 · Yalcin B. Acar, Robert J. Gale, et al. · Journal of Hazardous Materials · 665
Reliability challenges in 3D IC packaging technology
2010 · K.N. Tu · Microelectronics Reliability · 657
Current Saturation and Electrical Breakdown in Multiwalled Carbon Nanotubes
2001 · Philip G. Collins, M. Hersam, et al. · Physical Review Letters · 617
Properties of lead-free solder alloys with rare earth element additions
2004 · C.M.L. Wu, D.Q. Yu, et al. · Materials Science and Engineering R Reports · 590
Noise as a diagnostic tool for quality and reliability of electronic devices
1994 · L.K.J. Vandamme · IEEE Transactions on Electron Devices · 569
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The impact of technology scaling on lifetime reliability
2004 · J. Srinivasan, S.V. Adve, et al. · IEEE/IFIP International Conference on Dependable Systems and Networks (DSN) · 564
The Art of Analog Layout
2000 · A. E. Hastings · 538
Stress generation by electromigration
1976 · I. A. Blech, Conyers Herring · Applied Physics Letters · 517
Effects of electric current on solid state phase transformations in metals
2000 · Hans Conrad · Materials Science and Engineering A · 492
Mechanism of the Switchable Photovoltaic Effect in Ferroelectric BiFeO3
2011 · H. T. Yi, T. Choi, et al. · Advanced Materials · 440
Transition density: a new measure of activity in digital circuits
1993 · F.N. Najm · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 435
Copper Metallization for High Performance Silicon Technology
2000 · R. Rosenberg, D. C. Edelstein, et al. · Annual Review of Materials Science · 426
The role of viscous flow of oxide in the growth of self-ordered porous anodic alumina films
2009 · Jerrod E. Houser, Kurt R. Hebert · Nature Materials · 421
Works count: 13,470
Citation count: 187,900
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