Keyword

electron wind

Description: Electron wind is the momentum transfer from moving electrons to atoms in a material, which can drive atomic motion and electromigration.

Primary topic: Copper Interconnects and Reliability (29%)

OpenAlex ID: keywords/electron-wind

Overview no. 49

1986 · A.F. Sprecher, S.L. Mannan, et al. · Acta Metallurgica · 528

Thermally activated plastic flow of metals and ceramics with an electric field or current

2002 · Hans Conrad · Materials Science and Engineering A · 227

Accretion turnoff and rapid evaporation of very light secondaries in low-mass X-ray binaries

1989 · M. Ruderman, J. Shaham, et al. · The Astrophysical Journal · 200

Electromigration failure by shape change of voids in bamboo lines

1994 · E. Arzt, O. Kraft, et al. · Journal of Applied Physics · 183

Effects of electric current on the plastic deformation behavior of pure copper, iron, and titanium

2021 · C. Rudolf, R. Goswami, et al. · Acta Materialia · 166

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Modeling of thermal and mechanical behavior of a magnesium alloy AZ31 during electrically-assisted micro-tension

2016 · Xinwei Wang, Jie Xu, et al. · International Journal of Plasticity · 135

Driving force in electromigration

1974 · Rolf Landauer, James W. F. Woo · Physical review. B, Solid state · 108

Electromigration mechanisms in conductor lines: Void shape changes and slit-like failure

1997 · O. Kraft, E. Arzt · Acta Materialia · 106

Linear response theory of the driving forces for electromigration

1975 · P. Kumar, R.S. Sorbello · Thin Solid Films · 98

In situ scanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines

1992 · Paul R. Besser, Michael C. Madden, et al. · Journal of Applied Physics · 77

Effects of DC Current on the Mechanical Behavior of AlMg1SiCu

2006 · Joseph S. Andrawes, Thomas J. Kronenberger, et al. · Materials and Manufacturing Processes · 76

Numerical simulation of electromigration-induced shape changes of voids in bamboo lines

1995 · O. Kraft, E. Arzt · Applied Physics Letters · 73

A phase field model for failure in interconnect lines due to coupled diffusion mechanisms

2002 · Deepali N. Bhate, Allan F. Bower, et al. · Journal of the Mechanics and Physics of Solids · 71

The force of electromigration

1975 · A K Das, R Peierls · Journal of Physics C Solid State Physics · 56

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Crystal plasticity modeling of electropulsing induced plasticity in metals

2023 · Yang Yang, Rongshan Qin, et al. · International Journal of Plasticity · 55

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

2018 · Vahid Attari, Supriyo Ghosh, et al. · Acta Materialia · 53

Cavity and dislocation instability due to electric current

1994 · W. Yang, W. Wang, et al. · Journal of the Mechanics and Physics of Solids · 46

Application of a novel plasma-based advanced oxidation process for efficient and cost-effective destruction of refractory organics in tertiary effluents and contaminated groundwater

2009 · Itay Even-Ezra, Anat Mizrahi, et al. · Desalination and Water Treatment · 45

Electric current induced flow of liquid metals: Mechanism and substrate-surface effects

2014 · P. Kumar, J. Howarth, et al. · Journal of Applied Physics · 44

In situ observations of dc and ac electromigration in passivated Al lines

1991 · E. Castaño, J. Maiz, et al. · Applied Physics Letters · 40

The mechanism of an increase in electrical resistance in Al thin film induced by current stressing

2017 · Chien-Lung Liang, Ssu-Wei Lee, et al. · Thin Solid Films · 37

High temperature deformation behavior of the TC6 titanium alloy under the uniform DC electric field

2009 · Chuanhu Pei, Qunbo Fan, et al. · Journal of Alloys and Compounds · 36

Biased resistor network model for electromigration failure and related phenomena in metallic lines

2004 · C. Pennetta, E. Alfinito, et al. · Physical Review B · 34

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Physical basis of the electroplastic deformation of metals

1996 · A. M. Roschupkin, I. L. Bataronov · Russian Physics Journal · 30

Electromigration Failure Under Pulse Test Conditions

1978 · R. J. Miller · IEEE International Reliability Physics Symposium proceedings · 30

Works count: 168

Citation count: 3,205