Keyword

electron wind force

Description: The force exerted by conducting electrons on atoms or defects in a material, contributing to electromigration under electric current.

Primary topic: Electromagnetic Effects on Materials (28%)

OpenAlex ID: keywords/electron-wind-force

Electromigration failure modes in aluminum metallization for semiconductor devices

1969 · J.R. Black · Proceedings of the IEEE · 679

Electroplasticity in metals and ceramics

2000 · Hans Conrad · Materials Science and Engineering A · 534

Electromigration in ULSI interconnects

2007 · Cher Ming Tan, Arijit Roy · Materials Science and Engineering R Reports · 240

Dislocation structure evolution under electroplastic effect

2019 · Siqi Xiang, Xinfang Zhang · Materials Science and Engineering A · 222

Revealing the pulse-induced electroplasticity by decoupling electron wind force

2022 · Xing Li, Qi Zhu, et al. · Nature Communications · 153

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Diffuse interface model for electromigration and stress voiding

2000 · Deepali N. Bhate, Ashish Kumar, et al. · Journal of Applied Physics · 142

Theory of Electromigration

1998 · RICHARD S. SORBELLO · Solid state physics · 138

Electromigration in ULSI Interconnections

2010 · Cher Ming Tan · International series on advances in solid state electronics and technology · 136

Electroplasticity—the effect of electricity on the mechanical properties of metals

1990 · H. Conrad, A. F. Sprecher, et al. · JOM · 135

The Effects of Electric Currents and Fields on Deformation in Metals, Ceramics, and Ionic Materials: An Interpretive Survey

2004 · Stephen D. Antolovich, Hans Conrad · Materials and Manufacturing Processes · 91

Low temperature annealing of metals with electrical wind force effects

2018 · Daudi Waryoba, Zahabul Islam, et al. · Journal of Material Science and Technology · 82

Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects

2005 · Cher Ming Tan, Arijit Roy · Thin Solid Films · 78

Understanding the mechanisms of electroplasticity from a crystal plasticity perspective

2019 · Arka Lahiri, Pratheek Shanthraj, et al. · Modelling and Simulation in Materials Science and Engineering · 75

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In situ transmission electron microscopy investigation of electroplasticity in single crystal nickel

2021 · Xiaoqing Li, John Turner, et al. · Acta Materialia · 67

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Microstructure evolution in metals induced by high density electric current pulses

2015 · J. D. Guo, X. L. Wang, et al. · Materials Science and Technology · 67

Electromigration effect in Fe-Al diffusion couples with field-assisted sintering

2020 · Haoren Wang, Rui Kou, et al. · Acta Materialia · 61

Current density effects on the microstructure of zirconium thin films

2017 · Zahabul Islam, Baoming Wang, et al. · Scripta Materialia · 60

Electromigration and the local transport field in mesoscopic systems

1989 · Richard S. Sorbello · Physical review. B, Condensed matter · 59

Micromachined structures decoupling Joule heating and electron wind force

2024 · Shaojie Gu, Yasuhiro Kimura, et al. · Nature Communications · 57

Dynamic Study of the Physical Processes in the Intrinsic Line Electromigration of Deep-Submicron Copper and Aluminum Interconnects

2004 · C.M. Tan, G. Zhang, et al. · IEEE Transactions on Device and Materials Reliability · 57

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Current-induced forces: a simple derivation

2014 · Tchavdar N Todorov, Daniel Dundas, et al. · European Journal of Physics · 55

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Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints

2006 · Luhua Xu, John H. L. Pang, et al. · Applied Physics Letters · 54

Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints

2018 · Jiayun Feng, Chunjin Hang, et al. · Journal of Alloys and Compounds · 53

Regulating the recrystallized grain to induce strong cube texture in oriented silicon steel

2021 · Mengcheng Zhou, Xinfang Zhang · Journal of Material Science and Technology · 50

Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump

2011 · Myeong-Hyeok Jeong, Jae-Won Kim, et al. · Microelectronic Engineering · 46

Works count: 273

Citation count: 5,252