Keyword

electronic packaging

Description: The design and manufacture of structures that protect and connect electronic components and devices.

Primary topic: Electronic Packaging and Soldering Technologies (49%)

Wikidata ID: wiki/Q5358403

OpenAlex ID: keywords/electronic-packaging

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

2002 · K. Zeng, K.N. Tu · Materials Science and Engineering R Reports · 1,367

Microelectronics Packaging Handbook

1997 · Springer eBooks · 1,159

Polyethylene nanofibres with very high thermal conductivities

2010 · Sheng Shen, Asegun Henry, et al. · Nature Nanotechnology · 926

Thermal conductivity of polymers and polymer nanocomposites

2018 · Congliang Huang, Xin Qian, et al. · Materials Science and Engineering R Reports · 909

The Changing Automotive Environment: High-Temperature Electronics

2004 · R.W. Johnson, J.L. Evans, et al. · IEEE Transactions on Electronics Packaging Manufacturing · 869

A review of dielectric polymer composites with high thermal conductivity

2011 · Xingyi Huang, Pingkai Jiang, et al. · IEEE Electrical Insulation Magazine · 784

Advances in lead-free electronics soldering

2001 · Katsuaki Suganuma · Current Opinion in Solid State and Materials Science · 732

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

2006 · Yi Li, C.P. Wong · Materials Science and Engineering R Reports · 715

Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging

1999 · C. P. Wong, Raja S. Bollampally · Journal of Applied Polymer Science · 673

Ice‐Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement

2015 · Xiaoliang Zeng, Yimin Yao, et al. · Small · 619

A review of mechanical properties of lead-free solders for electronic packaging

2009 · Hongtao Ma, Jeffrey C. Suhling · Journal of Materials Science · 598

Particle-reinforced metal matrix nanocomposites fabricated by selective laser melting: A state of the art review

2019 · W.H. Yu, S.L. Sing, et al. · Progress in Materials Science · 587

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Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates

1984 · A. Bar-Cohen, W. M. Rohsenow · ASME Journal of Heat and Mass Transfer · 555

Thermally conducting aluminum nitride polymer-matrix composites

2001 · Yunsheng Xu, D.D.L Chung, et al. · Composites Part A Applied Science and Manufacturing · 541

Microelectronics Packaging Handbook

1989 · Rao R. Tummala, Eugene J. Rymaszewski, et al. · Journal of Electronic Packaging · 534

Bio-Polyethylene (Bio-PE), Bio-Polypropylene (Bio-PP) and Bio-Poly(ethylene terephthalate) (Bio-PET): Recent Developments in Bio-Based Polymers Analogous to Petroleum-Derived Ones for Packaging and Engineering Applications

2020 · Valentina Siracusa, Ignazio Blanco · Polymers · 530

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Foreword contributions from the 50th electronic components and technology conference

2001 · R. Boudreau · IEEE Transactions on Advanced Packaging · 517

Inkjet printing of conductive materials: a review

2012 · Gerard Cummins, Marc P.Y. Desmulliez · Circuit World · 506

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

1996 · H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 503

Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN

2017 · Jiantao Hu, Yun Huang, et al. · ACS Applied Materials & Interfaces · 500

Recent advances in microscale pumping technologies: a review and evaluation

2008 · Brian D. Iverson, Suresh V. Garimella · Microfluidics and Nanofluidics · 485

Die Attach Materials for High Temperature Applications: A Review

2011 · V R Manikam, Kuan Yew Cheong · IEEE Transactions on Components Packaging and Manufacturing Technology · 479

Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging

2000 · Andrei G. Fedorov, Raymond Viskanta · International Journal of Heat and Mass Transfer · 446

A Roadmap Review of Thermally Conductive Polymer Composites: Critical Factors, Progress, and Prospects

2023 · Zhengfang Wang, Zijian Wu, et al. · Advanced Functional Materials · 427

Subpixel displacement and deformation gradient measurement using digital image/speckle correlation

2001 · Peng Zhou, Kenneth E. Goodson · Optical Engineering · 425

Works count: 16,450

Citation count: 149,300