Keyword

interconnect reliability

Description: The ability of electrical connections in integrated circuits and electronic packages to maintain correct operation over time and use.

Primary topic: Copper Interconnects and Reliability (47%)

OpenAlex ID: keywords/interconnect-reliability

Models for contacts to planar devices

1972 · Microelectronics Reliability · 818

Light emitting diodes reliability review

2011 · Moon-Hwan Chang, Diganta Das, et al. · Microelectronics Reliability · 764

Multilevel interconnections for ULSI and GSI era

1997 · Shyam P. Murarka · Materials Science and Engineering R Reports · 349

2008 International Conference on Prognostics and Health Management

2008 · 314

Relationship between interfacial adhesion and electromigration in Cu metallization

2003 · M. W. Lane, E. G. Liniger, et al. · Journal of Applied Physics · 294

Reliability challenges for copper interconnects

2003 · Baozhen Li, Timothy D Sullivan, et al. · Microelectronics Reliability · 292

Copper metallization for ULSL and beyond

1995 · Shyam P. Murarka, Steven W. Hymes · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 259

Technology and reliability constrained future copper interconnects. I. Resistance modeling

2002 · P. Kapur, J.P. McVittie, et al. · IEEE Transactions on Electron Devices · 251

Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds

2011 · H. Xu, C. Liu, et al. · Acta Materialia · 249

Electromigration in ULSI interconnects

2007 · Cher Ming Tan, Arijit Roy · Materials Science and Engineering R Reports · 240

Electromigration in copper conductors

1995 · J.R. Lloyd, J.J. Clement · Thin Solid Films · 235

Full chip thermal analysis of planar (2-D) and vertically integrated (3-D) high performance ICs

2002 · Sungjun Im, K. Banerjee · Technical digest - International Electron Devices Meeting/Technical digest · 209

A highly resilient routing algorithm for fault-tolerant NoCs

2009 · David Fick, Andrew DeOrio, et al. · Design, Automation, and Test in Europe · 191

A model for stress-induced metal notching and voiding in very large-scale-integrated Al–Si (1%) metallization

1987 · J. W. McPherson, C. F. Dunn · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena · 178

Application of Probability Methods to the Determination of Spinning Reserve Requirements for the Pennsylvania-New Jersey-Maryland Interconnection

1963 · L. T. Anstine, R. E. Burke, et al. · IEEE Transactions on Power Apparatus and Systems · 168

Effect of Joule heating and current crowding on electromigration in mobile technology

2017 · K. N. Tu, Yingxia Liu, et al. · Applied Physics Reviews · 166

Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates

1996 · Zonghe Lai, Johan Liu · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 157

A highly resilient routing algorithm for fault-tolerant NoCs

2009 · D. Fick, A. DeOrio, et al. · Design, Automation, and Test in Europe · 154

Interconnect design for deep submicron ICs

1997 · Jason Cong, Zhigang Pan, et al. · 153

Analysis of failure mechanisms in electrically stressed Au nanowires

1999 · C. Durkan, M. A. Schneider, et al. · Journal of Applied Physics · 140

Intercalation Doped Multilayer-Graphene-Nanoribbons for Next-Generation Interconnects

2016 · Junkai Jiang, Jiahao Kang, et al. · Nano Letters · 139

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Recent Advances and Trends in Cu–Cu Hybrid Bonding

2023 · John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 137

Kinetics of copper drift in low-κ polymer interlevel dielectrics

1999 · A.L.S. Loke, J.T. Wetzel, et al. · IEEE Transactions on Electron Devices · 135

Advanced Interconnects: Materials, Processing, and Reliability

2014 · Mikhail R. Baklanov, Christoph Adelmann, et al. · ECS Journal of Solid State Science and Technology · 134

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Activation energy in the early stage of electromigration in Al-1% Si/TiN/Ti bamboo lines

1995 · I De Munari, A Scorzoni, et al. · Semiconductor Science and Technology · 123

Works count: 4,878

Citation count: 35,940