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Keyword

interposer

Description: An interposer is an electronic substrate that connects semiconductor chips, enabling dense electrical routing in advanced integrated-circuit packaging.
Wikidata ID: wiki/Q6056418
OpenAlex ID: keywords/interposer
25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV
2014 · Dong Uk Lee, Kyung Whan Kim, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 253
3D silicon integration
2008 · J.U. Knickerbocker, P.S. Andry, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 234
CO2 electroreduction to multicarbon products from carbonate capture liquid
2023 · Geonhui Lee, Armin Sedighian Rasouli, et al. · Joule · 174
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High RF performance TSV silicon carrier for high frequency application
2008 · Soon Wee Ho, Seung Wook Yoon, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 139
Interposer design optimization for high frequency signal transmission in passive and active interposer using through silicon via (TSV)
2011 · Namhoon Kim, Daniel Wu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 122
Interposer Technologies for High-Performance Applications
2017 · Ahmad Usman, Etizaz Shah, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 101
Fabric-Based Active Electrode Design and Fabrication for Health Monitoring Clothing
2009 · C.R. Merritt, H.T. Nagle, et al. · IEEE Transactions on Information Technology in Biomedicine · 99
A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing
2020 · Mu-Shan Lin, Tze-Chiang Huang, et al. · IEEE Journal of Solid-State Circuits · 96
Fundamental Building Blocks for Circuits on Textiles
2007 · I. Locher, G. Troster · IEEE Transactions on Advanced Packaging · 86
Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions
2013 · Seung Wook Yoon, Patrick Tang, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 80
A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters
2014 · Christophe Erdmann, Donnacha Lowney, et al. · IEEE Journal of Solid-State Circuits · 79
RF Glass Technology Is Going Mainstream: Review and Future Applications
2023 · Tobias Chaloun, Susanne Brandl, et al. · IEEE Journal of Microwaves · 76
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The world in 2025 - predictions for the next ten years
2015 · Robin Taylor, David Baron, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 72
Evolution and outlook of TSV and 3D IC/Si integration
2010 · John H. Lau · IEEE Electronics Packaging Technology Conference (EPTC) · 67
Ball-grid array architecture for microfabricated ion traps
2015 · Nicholas D. Guise, Spencer D. Fallek, et al. · Journal of Applied Physics · 62
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A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates
2023 · Pratik Nimbalkar, Pragna Bhaskar, et al. · Polymers · 61
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Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge
2014 · Yang Zhang, Yue Zhang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 61
Modern Trends in Microelectronics Packaging Reliability Testing
2024 · Emmanuel Bender, Joseph B. Bernstein, et al. · Micromachines · 58
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Low Df Polyimide with Photosensitivity for High Frequency Applications
2020 · Hitoshi Araki, Yohei Kiuchi, et al. · Journal of Photopolymer Science and Technology · 58
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Cost analysis and cost-driven IP reuse methodology for SoC design based on 2.5D/3D integration
2016 · Dylan Stow, Itir Akgun, et al. · 56
Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging
2014 · Ralph Delmdahl, Rainer Paetzel · Journal of the Microelectronics and Packaging Society · 55
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Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer
2022 · Minghao Zhou, Li Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 53
Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
2018 · Jisun Hong, Kyoungsei Choi, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 53
Compact and Reliable T/R Module Prototype for Advanced Space Active Electronically Steerable Antenna in 3-D LTCC Technology
2018 · Alessandro Di Carlofelice, Francesco de Paulis, et al. · IEEE Transactions on Microwave Theory and Techniques · 52
Thermal evaluation and analyses of 3D IC integration SiP with TSVs for network system applications
2012 · Heng-Chieh Chien, John H. Lau, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 51
Works count: 1,110
Citation count: 6,984
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