Keyword

junction temperature

Description: Junction temperature is the temperature at the active semiconductor junction in an electronic device, affecting its performance, reliability, and lifetime.

Primary topic: Silicon Carbide Semiconductor Technologies (29%)

Wikidata ID: wiki/Q6311800

OpenAlex ID: keywords/junction-temperature

High-temperature electronics - a role for wide bandgap semiconductors?

2002 · P.G. Neudeck, R.S. Okojie, et al. · Proceedings of the IEEE · 1,054

Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime

2008 · Reinhold Bayerer, Tobias Herrmann, et al. · 580

Solid-state lighting: failure analysis of white LEDs

2004 · N. Narendran, Y. Gu, et al. · Journal of Crystal Growth · 579

Silicon carbide benefits and advantages for power electronics circuits and systems

2002 · A. Elasser, T.P. Chow · Proceedings of the IEEE · 536

Thermoelectric cooler application in electronic cooling

2004 · Reiyu Chein, Guanming Huang · Applied Thermal Engineering · 354

Size-dependent light output, spectral shift, and self-heating of 400 nm InGaN light-emitting diodes

2010 · Zheng Gong, Shirong Jin, et al. · Journal of Applied Physics · 336

Reducing power density through activity migration

2003 · Seongmoo Heo, Kenneth Barr, et al. · International Symposium on Low Power Electronics and Design (ISLPED) · 314

Influence of junction temperature on chromaticity and color-rendering properties of trichromatic white-light sources based on light-emitting diodes

2005 · S. Chhajed, Y. Xi, et al. · Journal of Applied Physics · 303

Improved Outcoupling Efficiency and Stability of Perovskite Light‐Emitting Diodes using Thin Emitting Layers

2018 · Lianfeng Zhao, Kyung Min Lee, et al. · Advanced Materials · 285

New Physical Insights on Power MOSFET Switching Losses

2009 · Yali Xiong, Shan Sun, et al. · IEEE Transactions on Power Electronics · 283

High Switching Performance of 1700V, 50A SiC Power MOSFET over Si IGBT/BiMOSFET for Advanced Power Conversion Applications

2015 · Samir Hazra, Ankan De, et al. · IEEE Transactions on Power Electronics · 270

Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters

2013 · Laurent Dupont, Yvan Avenas, et al. · IEEE Transactions on Industry Applications · 233

Improved heat dissipation in gallium nitride light-emitting diodes with embedded graphene oxide pattern

2013 · Nam Han, Tran Viet Cuong, et al. · Nature Communications · 217

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A General Scheme for Calculating Switching- and Conduction-Losses of Power Semiconductors in Numerical Circuit Simulations of Power Electronic Systems

2015 · Uwe Drofenik, Johann W. Kolar · 207

Experimental and numerical investigation of a mini channel forced air heat sink designed by topology optimization

2018 · Shi Zeng, Bugra Kanargi, et al. · International Journal of Heat and Mass Transfer · 201

Junction and carrier temperature measurements in deep-ultraviolet light-emitting diodes using three different methods

2005 · Y. Xi, J.-Q. Xi, et al. · Applied Physics Letters · 198

Thermal management of high power electronics with phase change cooling

2000 · T.J. Lu · International Journal of Heat and Mass Transfer · 198

Monitoring Solder Fatigue in a Power Module Using Case-Above-Ambient Temperature Rise

2011 · Dawei Xiang, Li Ran, et al. · IEEE Transactions on Industry Applications · 193

Thermal management of 3D IC integration with TSV (through silicon via)

2009 · John H. Lau, Tang Gong Yue · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 191

Interlayer cooling potential in vertically integrated packages

2008 · T. Brunschwiler, B. Michel, et al. · Microsystem Technologies · 189

Analysis of thermoelectric cooler performance for high power electronic packages

2009 · H.Y. Zhang, Y.C. Mui, et al. · Applied Thermal Engineering · 188

Impact of Power Density Maximization on Efficiency of DC–DC Converter Systems

2009 · Juergen Biela, Uwe Badstuebner, et al. · IEEE Transactions on Power Electronics · 188

Topology optimization of liquid-cooled microchannel heat sinks: An experimental and numerical study

2019 · Shi Zeng, Poh Seng Lee · International Journal of Heat and Mass Transfer · 184

Electromagnetic transients simulation models for accurate representation of switching losses and thermal performance in power electronic systems

2005 · A.D. Rajapakse, A.M. Gole, et al. · IEEE Transactions on Power Delivery · 180

Reactive Power Influence on the Thermal Cycling of Multi-MW Wind Power Inverter

2013 · Ke Ma, Marco Liserre, et al. · IEEE Transactions on Industry Applications · 179

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Works count: 5,022

Citation count: 52,710