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Keyword

microbumps

Description: Small conductive bumps used to form electrical and mechanical connections between semiconductor chips and substrates in advanced electronic packaging.
OpenAlex ID: keywords/microbumps
Demystifying 3D ICs: The Pros and Cons of Going Vertical
2005 · W.R. Davis, J. Wilson, et al. · IEEE Design & Test of Computers · 836
Micro- and nanoscale characterization of hydrophobic and hydrophilic leaf surfaces
2006 · Bharat Bhushan, Yong Chae Jung · Nanotechnology · 352
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Structure and properties of lead-free solders bearing micro and nano particles
2014 · Liang Zhang, K.N. Tu · Materials Science and Engineering R Reports · 325
New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints
2020 · Peng Zhang, Songbai Xue, et al. · Materials & Design · 258
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Three-Dimensional Integration Technology Based on Wafer Bonding With Vertical Buried Interconnections
2006 · M. Koyanagi, T. Nakamura, et al. · IEEE Transactions on Electron Devices · 222
Formation of microbumps and nanojets on gold targets by femtosecond laser pulses
2004 · F. Korte, J. Koch, et al. · Applied Physics A · 210
A 1.2 V 12.8 GB/s 2 Gb Mobile Wide-I/O DRAM With 4 $\times$ 128 I/Os Using TSV Based Stacking
2011 · Jung-Sik Kim, Chi Sung Oh, et al. · IEEE Journal of Solid-State Circuits · 204
Underwater Oil Capture by a Three‐Dimensional Network Architectured Organosilane Surface
2011 · Meihua Jin, Jing Wang, et al. · Advanced Materials · 202
Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology
2018 · K.N. Tu, Yingxia Liu · Materials Science and Engineering R Reports · 192
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
2012 · K.N. Tu, Hsiang-Yao Hsiao, et al. · Microelectronics Reliability · 188
Advanced reliability study of TSV interposers and interconnects for the 28nm technology FPGA
2011 · Bahareh Banijamali, Suresh Ramalingam, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 182
Some recent topics in gold plating for electronics applications
1998 · Yutaka Okinaka, Masao Hoshino · Gold bulletin · 170
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Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices
2019 · D. B. Ingerly, S. Amin, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 157
Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS
2003 · Khalil Najafi · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 145
Assembly and reliability challenges in 3D integration of 28nm FPGA die on a large high density 65nm passive interposer
2012 · Raghunandan Chaware, Kumar Nagarajan, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 142
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management
2020 · Pascal Vivet, Eric Guthmuller, et al. · IEEE Journal of Solid-State Circuits · 132
Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review
2015 · D.K. Mu, S.D. McDonald, et al. · Current Opinion in Solid State and Materials Science · 122
Time-resolved studies of femtosecond-laser induced melt dynamics
2012 · Claudia Unger, Jrgen Koch, et al. · Optics Express · 119
Vertical interconnects of microbumps in 3D integration
2015 · Chih Chen, Doug Yu, et al. · MRS Bulletin · 112
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Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
2014 · John H. Lau · Journal of Electronic Packaging · 108
A 160Gb/s interface design configuration for multichip LSI
2004 · T. Ezaki, K. Kondo, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 84
Wafer thinning, bonding, and interconnects induced local strain/stress in 3D-LSIs with fine-pitch high-density microbumps and through-Si vias
2010 · M. Murugesan, H. Kino, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 81
Photodegradation of Methyl Orange under Visible Light by Micro-Nano Hierarchical Cu2O Structure Fabricated by Hybrid Laser Processing and Chemical Dealloying
2011 · Changsheng Dong, Minlin Zhong, et al. · ACS Applied Materials & Interfaces · 79
Electromigration in three-dimensional integrated circuits
2023 · Zesheng Shen, Siyi Jing, et al. · Applied Physics Reviews · 78
Semiconductor wafer bonding: a review of interfacial properties and applications
1992 · Stefan Bengstsson · Journal of Electronic Materials · 77
Works count: 1,118
Citation count: 11,990
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