Keyword

microelectronic packaging

Description: Microelectronic packaging is the engineering and fabrication of enclosures and interconnections that protect and integrate semiconductor devices and circuits.

Primary topic: Electronic Packaging and Soldering Technologies (44%)

Wikidata ID: wiki/Q759494

OpenAlex ID: keywords/microelectronics-packaging

Microelectronics Packaging Handbook

1997 · Springer eBooks · 1,159

Fundamentals of Microsystems Packaging

2001 · Rao Tummala · 828

Enhanced thermal conductivity of polymer composites filled with hybrid filler

2005 · Geon-Woong Lee, Min Park, et al. · Composites Part A Applied Science and Manufacturing · 819

Polyhedral Oligosilsesquioxane‐Modified Boron Nitride Nanotube Based Epoxy Nanocomposites: An Ideal Dielectric Material with High Thermal Conductivity

2012 · Xingyi Huang, Chunyi Zhi, et al. · Advanced Functional Materials · 647

Electromagnetic properties of Si–C–N based ceramics and composites

2014 · Xiaowei Yin, Luo Kong, et al. · International Materials Reviews · 623

Microelectronics Packaging Handbook

1989 · Rao R. Tummala, Eugene J. Rymaszewski, et al. · Journal of Electronic Packaging · 534

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

2013 · Ziyin Lin, Yan Liu, et al. · ACS Applied Materials & Interfaces · 471

Dielectric thermally conductive boron nitride/polyimide composites with outstanding thermal stabilities via in -situ polymerization-electrospinning-hot press method

2016 · Junwei Gu, Zhaoyuan Lv, et al. · Composites Part A Applied Science and Manufacturing · 417

Terahertz Imaging and Sensing Applications With Silicon-Based Technologies

2018 · Philipp Hillger, Janusz Grzyb, et al. · IEEE Transactions on Terahertz Science and Technology · 410

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Vertically Aligned Silicon Carbide Nanowires/Boron Nitride Cellulose Aerogel Networks Enhanced Thermal Conductivity and Electromagnetic Absorbing of Epoxy Composites

2022 · Duo Pan, Gui Yang, et al. · Nano-Micro Letters · 390

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Mechanical properties of nano-silver joints as die attach materials

2011 · Kim S. Siow · Journal of Alloys and Compounds · 390

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

2018 · Xutong Yang, Chaobo Liang, et al. · Advanced Composites and Hybrid Materials · 372

Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review

2022 · Yingfeng Wen, Chao Chen, et al. · Advanced Materials · 369

Wire bonding in microelectronics : materials, processes, reliability, and yield

1997 · George G. Harman · McGraw-Hill eBooks · 369

Wire Bonding in Microelectronics

2011 · Jin Yang · Assembly Automation · 340

Wireless micromachined ceramic pressure sensor for high-temperature applications

2002 · M.A. Fonseca, J.M. English, et al. · Journal of Microelectromechanical Systems · 320

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

2014 · Kim S. Siow · Journal of Electronic Materials · 317

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Optical Generation and Characterization of Acoustic Waves in Thin Films: Fundamentals and Applications

2000 · John A. Rogers, Alex A. Maznev, et al. · Annual Review of Materials Science · 308

Metal catalysts for the vinyl polymerization of norbornene

2001 · Christoph Janiak, Paul G Lassahn · Journal of Molecular Catalysis A Chemical · 302

Progress in low dielectric polyimide film – A review

2022 · Yahui Li, Gaohui Sun, et al. · Progress in Organic Coatings · 251

Wire bonding in microelectronics

2010 · George G. Harman · 247

Fundamental insight on developing low dielectric constant polyimides

1997 · J.O Simpson, A.K St.Clair · Thin Solid Films · 227

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Microjoining and nanojoining

2008 · Y. Zhou · Woodhead Publishing Limited eBooks · 226

Mechanics of Microelectronics

2006 · Zhang, G. Q, Fan, X. J, et al. · Solid mechanics and its applications · 209

Microjet cooling devices for thermal management of electronics

2003 · D.S. Kercher, Jeong-Bong Lee, et al. · IEEE Transactions on Components and Packaging Technologies · 203

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Works count: 4,388

Citation count: 49,670