Keyword

package reliability

Description: The ability of an electronic package to maintain its mechanical, electrical, and thermal integrity during manufacture and service.

Primary topic: Electronic Packaging and Soldering Technologies (67%)

OpenAlex ID: keywords/package-reliability

Light emitting diodes reliability review

2011 · Moon-Hwan Chang, Diganta Das, et al. · Microelectronics Reliability · 764

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

2009 · C.S. Selvanayagam, J.H. Lau, et al. · IEEE Transactions on Advanced Packaging · 301

InFO (Wafer Level Integrated Fan-Out) Technology

2016 · Chien-Fu Tseng, Chung-Shi Liu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 284

Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability

2004 · Z. Zhang, C.P. Wong · IEEE Transactions on Advanced Packaging · 250

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Thermal Conduction Module: A High-Performance Multilayer Ceramic Package

1982 · A. J. Blodgett, D. R. Barbour · IBM Journal of Research and Development · 214

Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering

1985 · I. Fukuzawa, S. Ishiguro, et al. · IEEE International Reliability Physics Symposium proceedings · 202

Impact life prediction modeling of TFBGA packages under board level drop test

2004 · Tong Yan Tee, Hun Shen Ng, et al. · Microelectronics Reliability · 193

Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability

2014 · R. Khazaka, L. Mendizabal, et al. · Journal of Electronic Materials · 191

Design for reliability of power electronics modules

2009 · Hua Lu, Chris Bailey, et al. · Microelectronics Reliability · 190

Moisture absorption and desorption predictions for plastic ball grid array packages

1997 · J.E. Galloway, B.M. Miles · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 188

Embedded wafer level ball grid array (eWLB)

2006 · M. Brunnbauer, E. F�rgut, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 187

Wafer level chip scale packaging (WL-CSP): an overview

2000 · P. Garrou · IEEE Transactions on Advanced Packaging · 183

Multichip Module Technologies and Alternatives: The Basics

1993 · Daryl Ann Doane, Paul D. Franzon · Springer eBooks · 164

Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

2003 · H. Ardebili, Ee Hua Wong, et al. · IEEE Transactions on Components and Packaging Technologies · 141

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

2023 · Haoyu Wang, Jianshe Ma, et al. · Micromachines · 134

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Aging Mechanisms and Accelerated Lifetime Tests for SiC MOSFETs: An Overview

2021 · Shi Pu, Fei Yang, et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 128

Board level drop test and simulation of TFBGA packages for telecommunication applications

2004 · Tong Yan Tee, Hun Shen Ng, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 125

An improved methodology for determining temperature dependent moduli of underfill encapsulants

2000 · Y. Rao, S.H. Shi, et al. · IEEE Transactions on Components and Packaging Technologies · 118

Present problems of power module packaging technology

2003 · N.Y.A Shammas · Microelectronics Reliability · 115

A Low-Temperature Thin-Film Electroplated Metal Vacuum Package

2004 · B.H. Stark, K. Najafi · Journal of Microelectromechanical Systems · 105

Materials and mechanics issues in flip-chip organic packaging

2002 · T.Y. Wu, Y. Tsukada, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 105

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 100

Demonstration of Highly Manufacturable STT-MRAM Embedded in 28nm Logic

2018 · Y. J. Song, J. H. Lee, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 94

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

2018 · John H. Lau, Ming Li, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 94

Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate

2016 · Yuan-Ting Lin, Wei-Hong Lai, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 90

Works count: 2,377

Citation count: 18,990