Keyword

post-CMP cleaning

Description: A semiconductor wafer-cleaning process performed after chemical mechanical polishing to remove residues and particles from device surfaces.

Primary topic: Advanced Surface Polishing Techniques (80%)

OpenAlex ID: keywords/post-cmp-cleaning

Chemical Mechanical Planarization of Microelectronic Materials

1997 · Joseph M. Steigerwald, Shyam P. Murarka, et al. · Wiley eBooks · 807

Chemical mechanical planarization for microelectronics applications

2004 · Parshuram B. Zantye, Ashok Kumar, et al. · Materials Science and Engineering R Reports · 626

Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

2006 · Yair Ein-Eli, David Starosvetsky · Electrochimica Acta · 203

Particle Adhesion and Removal in Chemical Mechanical Polishing and Post‐CMP Cleaning

1999 · Fan Zhang, Ahmed A. Busnaina, et al. · Journal of The Electrochemical Society · 123

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Particle adhesion and removal mechanisms in post-CMP cleaning processes

2002 · A.A. Busnaina, Hong Lin, et al. · IEEE Transactions on Semiconductor Manufacturing · 119

Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies

2022 · Chi-Hsiang Hsieh, Che-Yuan Chang, et al. · Micromachines · 104

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Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process

2016 · Byoung-Jun Cho, Shohei Shima, et al. · Applied Surface Science · 94

Effect of a novel chelating agent on defect removal during post-CMP cleaning

2016 · Jiao Hong, Xinhuan Niu, et al. · Applied Surface Science · 86

The Role of Particle Adhesion and Surface Deformation in Chemical Mechanical Polishing Processes

1999 · Fan Zhang · Electrochemical and Solid-State Letters · 79

Post-Cu CMP cleaning for colloidal silica abrasive removal

2004 · Po-Lin Chen, Jyh-Herng Chen, et al. · Microelectronic Engineering · 78

A review on the development of ceria for chemical mechanical polishing

2024 · Jiahui Ma, Ning Xu, et al. · Powder Technology · 77

Minimization of chemical-mechanical planarization (CMP) defects and post-CMP cleaning

1999 · Liming Zhang, Srini Raghavan, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 77

Direct and quantitative study of ceria–SiO2 interaction depending on Ce3+ concentration for chemical mechanical planarization (CMP) cleaning

2020 · Kyong Kyu Myong, Jinuk Byun, et al. · Materials Science in Semiconductor Processing · 72

Role of 1,2,4-Triazole as a Passivating Agent for Cobalt during Post-Chemical Mechanical Planarization Cleaning

2014 · Mingjie Zhong, Shyam S. Venkataraman, et al. · Journal of The Electrochemical Society · 71

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Characterization of TMAH based cleaning solution for post Cu-CMP application

2012 · R. Prasanna Venkatesh, Tae-Young Kwon, et al. · Microelectronic Engineering · 69

Chemical Mechanical Planarization Historical Review and Future Direction

2008 · Gautam Banerjee, Robert L. Rhoades · ECS Transactions · 63

Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning

2021 · Samrina Sahir, Nagendra Prasad Yerriboina, et al. · Applied Surface Science · 61

Post Cleaning for FEOL CMP with Silica and Ceria Slurries

2017 · Wei-Tsu Tseng, Changhong Wu, et al. · ECS Journal of Solid State Science and Technology · 58

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Study of the cross contamination effect on post CMP in situ cleaning process

2015 · Hong Jin Kim, Girish Bohra, et al. · Microelectronic Engineering · 58

Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning

2019 · Heon-Yul Ryu, Byoung-Jun Cho, et al. · ECS Journal of Solid State Science and Technology · 57

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Assessment of post-CMP cleaning mechanisms using statistically-designed experiments

1998 · G. Zhang, G. Burdick, et al. · Thin Solid Films · 54

Study on effect of complexing agents on Co oxidation/dissolution for chemical-mechanical polishing and cleaning process

2020 · Ohsung Kwon, KiHo Bae, et al. · Microelectronic Engineering · 52

Post-CMP Cleaning Solutions for the Removal of Organic Contaminants with Reduced Galvanic Corrosion at Copper/Cobalt Interface for Advanced Cu Interconnect Applications

2019 · Jihoon Seo, S. S. R. K. Hanup Vegi, et al. · ECS Journal of Solid State Science and Technology · 51

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Effect of chelating agent on benzotriazole removal during post copper chemical mechanical polishing cleaning

2014 · Yingxin Miao, Shengli Wang, et al. · Microelectronic Engineering · 51

Research progress on the application of ceria nanoparticles as abrasives in dielectric layer CMP and post cleaning: Structure, morphology, doping, and mechanism

2023 · Xinyu Han, Renhao Liu, et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects · 49

Works count: 590

Citation count: 6,482