Keyword

semiconductor packaging

Description: Semiconductor packaging is the process and technology of enclosing semiconductor devices to protect them and connect them to electronic systems.

Primary topic: Electronic Packaging and Soldering Technologies (42%)

Wikidata ID: wiki/Q759494

OpenAlex ID: keywords/semiconductor-packaging

Microelectronics Packaging Handbook

1997 · Springer eBooks · 1,159

Flip Chip Technologies

1995 · John H. Lau · 618

Disturbance observer and feedforward design for a high-speed direct-drive positioning table

1999 · C.J. Kempf, S. Kobayashi · IEEE Transactions on Control Systems Technology · 571

Microelectronics Packaging Handbook

1989 · Rao R. Tummala, Eugene J. Rymaszewski, et al. · Journal of Electronic Packaging · 534

Controlled Collapse Reflow Chip Joining

1969 · L. F. Miller · IBM Journal of Research and Development · 366

Contamination, ecological risk and source apportionment of heavy metals in sediments and water of a contaminated river in Taiwan

2017 · Chi Thanh Vu, Chitsan Lin, et al. · Ecological Indicators · 269

Handbook of 3D integration : technology and applications of 3D integrated circuits

2012 · Philip E. Garrou, Christopher A. Bower, et al. · 226

Spreading Resistance in Cylindrical Semiconductor Devices

1960 · David P. Kennedy · Journal of Applied Physics · 225

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

2008 · Eun‐Sung Lee, Sang‐Mock Lee, et al. · Journal of the American Ceramic Society · 221

Optical semiconductor devices

1999 · Mitsuo Fukuda · Medical Entomology and Zoology · 210

Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis

2018 · Keon‐Soo Jang, Yong‐Sung Eom, et al. · Journal of Applied Polymer Science · 200

Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

2005 · Myung Jin Yim, Kyung Wook Paik · International Journal of Adhesion and Adhesives · 194

Heterogeneous Integration for Performance and Scaling

2016 · Subramanian S. Iyer · IEEE Transactions on Components Packaging and Manufacturing Technology · 188

Spectral-approximation-based intelligent modeling for distributed thermal processes

2005 · Hua Deng, Han-Xiong Li, et al. · IEEE Transactions on Control Systems Technology · 188

Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions

2005 · Ravi Prasher · Intel Technology Journal · 181

Multichip Module Technologies and Alternatives: The Basics

1993 · Daryl Ann Doane, Paul D. Franzon · Springer eBooks · 164

Comprehensive model for humidity testing correlation

1987 · Microelectronics Reliability · 160

Recent Advances and New Trends in Flip Chip Technology

2016 · John H. Lau · Journal of Electronic Packaging · 157

Properties of Thin Polyimide Films

1980 · L. B. Rothman · Journal of The Electrochemical Society · 157

Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers

1993 · G. P. Peterson, A. B. Duncan, et al. · ASME Journal of Heat and Mass Transfer · 155

Microelectronics Packaging Handbook

1988 · Springer eBooks · 149

Analysis of thermal transient data with synthesized dynamic models for semiconductor devices

1995 · J.W. Sofia · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 145

Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

2003 · H. Ardebili, Ee Hua Wong, et al. · IEEE Transactions on Components and Packaging Technologies · 141

Semiconductor Advanced Packaging

2021 · John H. Lau · Springer eBooks · 140

Wafer-level Cu–Cu bonding technology

2011 · Ya-Sheng Tang, Yao-Jen Chang, et al. · Microelectronics Reliability · 140

Works count: 8,392

Citation count: 30,960