Keyword

solder paste

Description: A mixture of powdered solder alloy and flux used to attach surface-mount electronic components to circuit-board pads.

Primary topic: Electronic Packaging and Soldering Technologies (89%)

Wikidata ID: wiki/Q977971

OpenAlex ID: keywords/solder-paste

Characterization of eutectic Sn-Bi solder joints

1992 · Z. Mei, J. W. Morris · Journal of Electronic Materials · 315

Lead‐free reflow soldering for electronics assembly

2001 · M.R. Harrison, J.H. Vincent, et al. · Soldering and Surface Mount Technology · 156

Thermal transient characteristics of die attach in high power LED PKG

2008 · Hyun-Ho Kim, Sang-Hyun Choi, et al. · Microelectronics Reliability · 145

Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy

2008 · Ping Liu, Pei Yao, et al. · Journal of Electronic Materials · 143

Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating

2000 · Katsuaki Suganuma, Toshikazu Murata, et al. · Journal of materials research/Pratt's guide to venture capital sources · 142

Attributional and Consequential Environmental Assessment of the Shift to Lead-Free Solders (10 pp)

2005 · Tomas Ekvall, Anders Andrae · The International Journal of Life Cycle Assessment · 132

Alloying influences on low melt temperature SnZn and SnBi solder alloys for electronic interconnections

2016 · Guang Ren, Ian J. Wilding, et al. · Journal of Alloys and Compounds · 130

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

2020 · Mu-lan Li, Liang Zhang, et al. · Materials & Design · 122

Solder Paste in Electronics Packaging

1989 · Jennie S. Hwang · Springer eBooks · 110

Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles

2001 · F. Guo, J. Lee, et al. · Journal of Electronic Materials · 107

Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds

2011 · A.S.M.A. Haseeb, M.M. Arafat, et al. · Materials Characterization · 98

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

2004 · Y.C. Sohn, Jin Yu, et al. · Journal of materials research/Pratt's guide to venture capital sources · 95

A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs

2021 · Chongyang Cai, Jiefeng Xu, et al. · Microelectronics Reliability · 92

An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder

2003 · D.C. Lin, S. Liu, et al. · Materials Science and Engineering A · 89

Solders and soldering : materials, design, production, and analysis for reliable bonding

2001 · Howard H. Manko · CERN Document Server (European Organization for Nuclear Research) · 88

Transient liquid phase Ag-based solder technology for high-temperature packaging applications

2013 · Ahmed Sharif, Chee Lip Gan, et al. · Journal of Alloys and Compounds · 85

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Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder

2003 · D.C. Lin, G.X. Wang, et al. · Materials Letters · 85

Flux effect on void quantity and size in soldered joints

2016 · D. Bušek, K. Dušek, et al. · Microelectronics Reliability · 83

The Atmospheric Scanning Electron Microscope with open sample space observes dynamic phenomena in liquid or gas

2011 · Mitsuo Suga, Hidetoshi Nishiyama, et al. · Ultramicroscopy · 78

Solder Paste in Electronics Packaging

1992 · Jennie S. Hwang · Springer eBooks · 78

The influence of copper nanopowders on microstructure and hardness of lead–tin solder

2002 · D Lin, G.X Wang, et al. · Materials Letters · 71

Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications

2011 · E George, D Das, et al. · IEEE Transactions on Device and Materials Reliability · 66

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Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping

2003 · Dionysios Manessis, Rainer Patzelt, et al. · Microelectronics Reliability · 63

Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive

2011 · Yong-Sung Eom · ETRI Journal · 62

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Effect of nano-Al addition on properties and microstructure of low-Ag content Sn–1Ag–0.5Cu solders

2016 · Lei Sun, Liang Zhang, et al. · Journal of Materials Science Materials in Electronics · 58

Works count: 2,006

Citation count: 9,286