Keyword

surface mount technology

Description: An electronics manufacturing method in which components are mounted directly onto the surface of printed circuit boards.

Primary topic: Electronic Packaging and Soldering Technologies (52%)

OpenAlex ID: keywords/surface-mount-technology

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

2002 · K. Zeng, K.N. Tu · Materials Science and Engineering R Reports · 1,367

Printed Circuits Handbook

2007 · Clyde F. Coombs · 401

Electrical Engineering Handbook

2010 · The electrical engineering handbook/Electrical engineering handbook series/Electrical engineering handbook · 366

Microstructure evolution of eutectic Sn-Ag solder joints

1994 · Wenge Yang, Robert W. Messler, et al. · Journal of Electronic Materials · 276

Predictive model-based quality inspection using Machine Learning and Edge Cloud Computing

2020 · Jacqueline Schmitt, Jochen Bönig, et al. · Advanced Engineering Informatics · 207

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Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

1989 · Noriyuki Kinjo, Masatsugu Ogata, et al. · Advances in polymer science · 201

Development of Heterojunction Back Contact Si Solar Cells

2014 · Junichi Nakamura, Naoki Asano, et al. · IEEE Journal of Photovoltaics · 172

Application of Neural Networks in Optical Inspection and Classification of Solder Joints in Surface Mount Technology

2006 · G. Acciani, G. Brunetti, et al. · IEEE Transactions on Industrial Informatics · 168

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

1998 · Y.C Chan, Alex C.K So, et al. · Materials Science and Engineering B · 165

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

2005 · S. K. Kang, P. Lauro, et al. · IBM Journal of Research and Development · 153

Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints

1997 · P.L. Tu, Y.C. Chan, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 151

Electrically conductive adhesives for surface mount solder replacement

1996 · M. Zwolinski, J. Hickman, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 144

Surface Mount Technology: Principles and Practice

1997 · Ray P. Prasad, Ray P. Prasad · CERN Document Server (European Organization for Nuclear Research) · 143

Thermal Management of Electronic Equipment: A Review of Technology and Research Topics

1986 · Wataru Nakayama · Applied Mechanics Reviews · 142

Tin whiskers studied by focused ion beam imaging and transmission electron microscopy

2002 · George T. T. Sheng, C. F. Hu, et al. · Journal of Applied Physics · 138

Surface Mount Technology

1997 · Ray P. Prasad · Springer eBooks · 137

Viscoplastic Anand model for solder alloys and its application

2000 · Z.N. Cheng, G.Z. Wang, et al. · Soldering and Surface Mount Technology · 131

MMIC based phased array radar T/R modules

2011 · Timothy Boles, Douglas J. Carlson, et al. · IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS) · 126

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

2003 · Bob Willis · Microelectronics International · 122

A scientific guide to surface mount technology

1988 · C. H. Lea · Medical Entomology and Zoology · 120

Ordered restriction endonuclease maps of yeast artificial chromosomes created by optical mapping on surfaces.

1995 · W Cai, H Aburatani, et al. · Proceedings of the National Academy of Sciences · 116

Single-machine scheduling with maintenance and repair rate-modifying activities

2001 · Chung-Yee Lee, Chen-Sin Lin · European Journal of Operational Research · 113

Electrically conductive adhesives: a prospective alternative for SMD soldering?

1995 · J.C. Jagt, P.J.M. Beris, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 111

Solder Paste in Electronics Packaging

1989 · Jennie S. Hwang · Springer eBooks · 110

Development of low-loss band-pass filters using SAW resonators for portable telephones

2003 · O. Ikata, T. Miyashita, et al. · Proceedings/Proceedings - IEEE Ultrasonics Symposium · 107

Works count: 7,042

Citation count: 25,270