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Keyword

ULSI

Description: Ultra-large-scale integration, a semiconductor technology that packs very large numbers of components onto a single integrated circuit.
Wikidata ID: wiki/Q3547223
OpenAlex ID: keywords/ulsi
Interconnect scaling-the real limiter to high performance ULSI
2002 · M.T. Bohr · Technical digest - International Electron Devices Meeting/Technical digest · 553
Resists for sub-20-nm electron beam lithography with a focus on HSQ: state of the art
2009 · A E Grigorescu, C W Hagen · Nanotechnology · 424
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Full copper wiring in a sub-0.25 μm CMOS ULSI technology
2002 · D. Edelstein, J. Heidenreich, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 358
Characterization and metrology for ULSI technology
2006 · David G. Seiler · Characterization and Metrology for ULSI Technology · 350
Multilevel interconnections for ULSI and GSI era
1997 · Shyam P. Murarka · Materials Science and Engineering R Reports · 349
High-performance interconnects: an integration overview
2001 · R.H. Havemann, J.A. Hutchby · Proceedings of the IEEE · 340
Gate Dielectrics and MOS ULSIs
1997 · Takashi Hori · Springer series in electrophysics · 326
Copper metallization for ULSL and beyond
1995 · Shyam P. Murarka, Steven W. Hymes · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 259
Advanced multilayer metallization schemes with copper as interconnection metal
1993 · S.P. Murarka, R.J. Gutmann, et al. · Thin Solid Films · 249
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
2005 · A.H. Ajami, K. Banerjee, et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 215
Review of polymer materials with low dielectric constant
2010 · Xiong‐Yan Zhao, Hong‐Jie Liu · Polymer International · 214
Metallization: theory and practice for VLSI and ULSI
1993 · Choice Reviews Online · 208
Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration
1997 · Valery M. Dubin, Yosi Shacham‐Diamand, et al. · Journal of The Electrochemical Society · 197
A system architecture solution for unreliable nanoelectronic devices
2002 · Jie Han, P. Jonker · IEEE Transactions on Nanotechnology · 185
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Focused ion beam applications to solid state devices
1996 · Shinji Matsui, Yukinori Ochiai · Nanotechnology · 169
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Fluorinated amorphous carbon thin films grown by plasma enhanced chemical vapor deposition for low dielectric constant interlayer dielectrics
1995 · Kazuhiko Endo, Toru Tatsumi · Journal of Applied Physics · 166
Resolution limits of optical lithography
1991 · Shinji Okazaki · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 161
Ferroelectric Negative Capacitance Field Effect Transistor
2018 · Luqi Tu, Xudong Wang, et al. · Advanced Electronic Materials · 156
Advanced Interconnects for ULSI Technology
2012 · Wiley eBooks · 147
Porous low dielectric constant materials for microelectronics
2005 · Mikhail R Baklanov, Karen Maex · Philosophical Transactions of the Royal Society A Mathematical Physical and Engineering Sciences · 147
Ultra-thin oxide reliability for ULSI applications
2000 · Ernest Y Wu, James H Stathis, et al. · Semiconductor Science and Technology · 147
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Electromigration in thin-film interconnection lines: models, methods and results
1991 · Andrea Scorzoni, Bruno Neri, et al. · Materials Science Reports · 146
Atomic Layer Deposition of Silicon Nitride Thin Films: A Review of Recent Progress, Challenges, and Outlooks
2016 · Xin Meng, Young-Chul Byun, et al. · Materials · 140
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Shallow junction doping technologies for ULSI
1998 · Erin C. Jones, Emi Ishida · Materials Science and Engineering R Reports · 124
Chemical Structures of the SiO2Si Interface
1995 · Takeo Hattori · Critical reviews in solid state and materials sciences/CRC critical reviews in solid state and materials sciences · 117
Works count: 1,801
Citation count: 17,190
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